• MX25L6406EMI-12G SOIC-16
MX25L6406EMI-12G SOIC-16

MX25L6406EMI-12G

Product Description Demo for Development

Quantity Unit Price(USD) Ext. Price
1 $1.583 $1.58
200 $0.614 $122.80
500 $0.592 $296.00
1000 $0.581 $581.00

Inventory:5,903

*The price is for reference only.
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Submit your quote request for MX25L6406EMI-12G using this form.You can also reach us via email at Email: [email protected], and we will respond within 12 hours.

Overview of MX25L6406EMI-12G

The MX25L6406EMI-12G is a flash memory optimized for high-speed and low-voltage operations, providing excellent performance for various applications such as compact embedded systems, fast SSD solutions, and advanced industrial PCs.

Pinout

The MX25L6406EMI-12G pinout refers to the configuration and function of each pin in its SOIC-16 package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the MX25L6406EMI-12G has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • Multibyte programming support: Enables efficient data transfer and storage.
  • Flash memory endurance high: Ensures reliable data retention over time.
  • Data integrity protection strong: Guarantees accurate data transmission and reception.
  • Error correction code supported: Enhances data reliability by detecting and correcting errors.
  • Bus protocol flexibility offered: Supports various bus protocols for seamless integration.
  • Data transfer speed fast and reliable: Enables rapid data transfer with minimal errors.
  • Power-down mode for low power consumption: Reduces power consumption during idle periods.
  • I/O interface compatibility wide: Supports various I/O interfaces for broad compatibility.
  • Advanced security features: Provides robust data protection and encryption.
  • Multiple I/O modes support: Enables flexible I/O configurations for diverse applications.
  • Data retention time extension: Enhances data retention capabilities for long-term storage.
  • SPI and QPI interfaces supported: Supports popular interfaces for seamless integration.
  • High-speed serial interface: Enables rapid data transfer over long distances.
  • Low voltage detection: Detects low voltage levels to ensure reliable operation.
  • Power-down mode wake-up: Allows the device to quickly resume normal operation from power-down state.
  • Security features advanced: Provides robust data protection and encryption for sensitive applications.
  • Data retention time long: Enhances data retention capabilities for long-term storage.
  • Program and erase operations efficient: Enables fast and reliable programming and erasure of the device.
  • Data integrity protection robust: Guarantees accurate data transmission and reception.
  • Dual interface operation: Supports simultaneous operation on multiple interfaces for increased flexibility.
  • Program and erase operations fast: Enables rapid programming and erasure of the device.
  • Read and write operations reliable: Ensures accurate data transfer and storage.
  • Page buffer refresh supported: Refreshes page buffers to maintain data integrity.

Applications

The MX25L6406EMI-12G is suitable for various applications such as:

  • Compact embedded systems
  • Fast SSD solutions
  • Advanced industrial PCs
  • Automotive electronics
  • Medical devices

Advantages and Disadvantages

Advantages:

  • Fast data transfer rates
  • High storage capacity
  • Low power consumption
  • Robust data protection
  • Wide I/O interface compatibility

Disadvantages:

  • Potential for data corruption during programming or erasure
  • Sensitivity to environmental factors such as temperature and humidity

Equivalents

For similar functionalities, consider these alternatives to the MX25L6406EMI-12G:

MX25L6406EMI-12G

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) EAR99 Part Status NRND
HTS 8542.32.00.71 Automotive No
PPAP No Cell Type NOR
Chip Density (bit) 64M Architecture Sectored
Boot Block No Block Organization Symmetrical
Address Bus Width (bit) 1 Sector Size 4Kbyte x 2048
Page Size 256byte Number of Bits/Word (bit) 8/16
Number of Words 64M/32M Programmability Yes
Timing Type Synchronous Max. Access Time (ns) 8
Maximum Erase Time (s) 80/Chip Maximum Programming Time (ms) 3/Page
Process Technology 110nm, CMOS Interface Type Serial (SPI, Dual SPI)
Minimum Operating Supply Voltage (V) 2.7 Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6 Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 25 Program Current (mA) 20
Minimum Operating Temperature (°C) -40 Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial Command Compatible Yes
ECC Support No Support of Page Mode No
Minimum Endurance (Cycles) 100000(Typ) Mounting Surface Mount
Package Height 2.39 Package Width 7.52
Package Length 10.3 PCB changed 16
Standard Package Name SO Supplier Package SOP
Pin Count 16 Lead Shape Gull-wing

Warranty & Returns

Warranty, Returns, and Additional Information

  • QA & Return Policy ?

    Parts Quality Guarantee: 365 days

    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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MX25L6406EMI-12G

Product Description Demo for Development

Inventory:

5,903