• MX29GL256FDT2I-11G TFSOP-56
MX29GL256FDT2I-11G TFSOP-56

MX29GL256FDT2I-11G

Parallel 256MBIT Flash Memory IC in 56TSOP Package

Quantity Unit Price(USD) Ext. Price
1 $8.833 $8.83
200 $3.419 $683.80
500 $3.299 $1,649.50
1000 $3.238 $3,238.00

Inventory:7,738

*The price is for reference only.
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Overview of MX29GL256FDT2I-11G

The MX29GL256FDT2I-11G is a 256Mb flash memory IC with a 3V supply voltage and a data transfer rate of 80MHz. It is designed for use in various embedded systems and applications requiring non-volatile memory storage.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • A0-A20: Address Inputs
  • DQ0-DQ15: Data I/O
  • WE#: Write Enable
  • CE#: Chip Enable
  • OE#: Output Enable
  • BHE#: Byte Enable
  • RY/BY#: Ready/Busy Output
  • VCC: Power Supply
  • GND: Ground

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the MX29GL256FDT2I-11G flash memory IC for a visual representation.

Key Features

  • 256Mb Flash Memory: Offers large non-volatile memory storage capacity for data and program storage.
  • 3V Supply Voltage: Operates with a 3V power supply, suitable for low-power embedded applications.
  • 80MHz Data Transfer Rate: Provides fast data transfer speeds for efficient read and write operations.
  • 18 Address Inputs: Allows for flexible memory addressing within the 256Mb memory space.
  • Multiple Control Inputs: Supports various control signals for write, read, and enable operations.
  • Compact Package: Available in a space-saving form factor for easy integration into circuit designs.

Note: For detailed technical specifications, please refer to the MX29GL256FDT2I-11G datasheet.

Application

  • Embedded Systems: Ideal for use in embedded systems requiring non-volatile program and data storage.
  • Consumer Electronics: Suitable for various consumer electronic devices, such as set-top boxes and digital cameras.
  • Industrial Automation: Used in industrial automation applications for program storage and data logging.

Functionality

The MX29GL256FDT2I-11G is a high-capacity flash memory IC that provides reliable and fast non-volatile storage for a wide range of applications, ensuring data integrity and program reliability.

Usage Guide

  • Power Supply: Connect VCC (Pin 8) to the 3V power supply and GND (Pin 9) to ground.
  • Data Interface: Use the Data I/O pins (DQ0-DQ15) for data input and output operations.
  • Control Signals: Utilize the various control inputs for write, read, and enable operations based on the system requirements.

Frequently Asked Questions

Q: What is the maximum data transfer rate of the MX29GL256FDT2I-11G?
A: The MX29GL256FDT2I-11G supports a maximum data transfer rate of 80MHz for efficient read and write operations.

Q: Is the MX29GL256FDT2I-11G suitable for battery-operated devices?
A: Yes, the MX29GL256FDT2I-11G operates at a 3V supply voltage, making it compatible with low-power and battery-operated devices requiring flash memory storage.

Equivalent

For similar functionalities, consider these alternatives to the MX29GL256FDT2I-11G:

  • Spansion S29GL256M: A comparable flash memory IC with similar specifications and performance characteristics.
  • Winbond W25Q256FV: This flash memory IC offers comparable capacity and features for non-volatile storage applications.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) EAR99 Part Status Active
HTS 8542.32.00.71 Automotive No
PPAP No Cell Type NOR
Chip Density (bit) 256M Architecture Sectored
Boot Block Yes Block Organization Symmetrical
Location of Boot Block Top|Bottom Address Bus Width (bit) 24
Sector Size 128Kbyte x 256 Page Size 8Words/16byte
Number of Bits/Word (bit) 8/16 Number of Words 32M/16M
Programmability Yes Timing Type Asynchronous
Max. Access Time (ns) 110 Maximum Erase Time (s) 300/Chip
Maximum Page Access Time (ns) 30 Maximum Programming Time (ms) 350000/Chip
OE Access Time (ns) 30 Interface Type Parallel
Minimum Operating Supply Voltage (V) 3 Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6 Programming Voltage (V) 3 to 3.6
Operating Current (mA) 100 Page Read Current (mA) 20
Program Current (mA) 30 Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85 Supplier Temperature Grade Industrial
Command Compatible Yes ECC Support No
Support of Page Mode Yes Mounting Surface Mount
Package Height 1 Package Width 18.4
Package Length 14 PCB changed 56
Standard Package Name SO Supplier Package TSOP-I
Pin Count 56 Lead Shape Gull-wing

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MX29GL256FDT2I-11G

Parallel 256MBIT Flash Memory IC in 56TSOP Package

Inventory:

7,738