• MX25U1635EZNI-10G WDFN-8
MX25U1635EZNI-10G WDFN-8

MX25U1635EZNI-10G

WSON package with 8 pins and an access time of 8ns

Inventory:5,802

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Overview of MX25U1635EZNI-10G

The Macronix MX25U1635EZNI-10G is a NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 16M-bit 2M x 8 8ns 8-Pin WSON EP optimized for high-speed and low-voltage operations. It provides excellent performance for analog and digital signal switching.

Pinout

The MX25U1635EZNI-10G pinout refers to the configuration and function of each pin in its 8-WDFN Exposed Pad package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the MX25U1635EZNI-10G has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • Fast, reliable, secure: The MX25U1635EZNI-10G offers high-speed data transfer rates of up to 133 MHz for fast programming and erasure operations.
  • Poweful, efficient, durable: This NOR Flash memory device is designed to operate in a wide range of temperatures (-40°C to 85°C) and provides reliable performance even under harsh conditions.
  • Compact, rugged, versatile: The MX25U1635EZNI-10G's compact WSON package makes it suitable for use in a variety of applications where space is limited, such as industrial control systems or automotive electronics.
  • Robust, high-speed, dependable: This device features robust error correction mechanisms to ensure reliable data storage and retrieval even in the presence of noise or interference.
  • Efficient, low-profile, long-lasting: The MX25U1635EZNI-10G is designed for long-term reliability and can withstand harsh environmental conditions without compromising its performance.

Applications

  • Automotive: Used for storing code/data in automotive systems such as infotainment, dashboard displays, and control units.
  • Industrial: Suitable for applications like factory automation, machine-to-machine communication, and industrial IoT devices.
  • Consumer Electronics: Commonly used in devices like smart TVs, digital cameras, and gaming consoles for firmware and data storage.
  • Networking: Ideal for routers, switches, and network appliances that require high-speed, reliable data storage.
  • Telecommunications: Used in equipment like base stations, modems, and routers for storing configuration data and firmware.

Advantages and Disadvantages

Advantages

  • Fast programming and erasure times: The MX25U1635EZNI-10G offers fast programming and erasure operations, making it suitable for applications where data needs to be quickly updated or retrieved.
  • High reliability and durability: This device is designed to operate reliably even in harsh environmental conditions, making it suitable for use in a variety of applications where reliability is critical.
  • Compact package size: The MX25U1635EZNI-10G's compact WSON package makes it suitable for use in applications where space is limited, such as industrial control systems or automotive electronics.

Disadvantages

  • Sensitivity to noise and interference: The MX25U1635EZNI-10G may be sensitive to noise and interference, which can affect its performance in certain applications.
  • Limited write endurance: This device has a limited number of write cycles before it becomes unreliable, making it less suitable for applications where data is constantly being written or updated.

Equivalents

For similar functionalities, consider these alternatives to the MX25U1635EZNI-10G:

  • SST39LF200A: A 16M-bit NOR Flash memory device with a similar architecture and performance characteristics.
  • Winbond W25Q64BV: A 64M-bit NOR Flash memory device with a similar architecture and performance characteristics, but with a larger storage capacity.
  • Spansion S29GL064N90TFI00: A 64M-bit NOR Flash memory device with a similar architecture and performance characteristics, but with a different package type (TSOP).

Frequently Asked Questions

Q: What is the maximum operating temperature for the MX25U1635EZNI-10G?
A: The maximum operating temperature for the MX25U1635EZNI-10G is 85°C.

Q: How many write cycles can the MX25U1635EZNI-10G withstand before it becomes unreliable?
A: The MX25U1635EZNI-10G can withstand up to 100,000 write cycles before it becomes unreliable.

Q: What is the typical current consumption of the MX25U1635EZNI-10G during active operation?
A: The typical current consumption of the MX25U1635EZNI-10G during active operation is 20 mA.

Q: Can the MX25U1635EZNI-10G be used in automotive applications?
A: Yes, the MX25U1635EZNI-10G can be used in automotive applications where it will operate reliably even in harsh environmental conditions.

MX25U1635EZNI-10G

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code Yes Part Life Cycle Code Not Recommended
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD Part Package Code QFN
Package Description HVSON, SOLCC8,.25 Pin Count 8
Reach Compliance Code ECCN Code EAR99
HTS Code 8542.32.00.51 Factory Lead Time 24 Weeks
Additional Feature ALSO CONFIGURABLE AS 16M X 1 Alternate Memory Width 2
Clock Frequency-Max (fCLK) 104 MHz Data Retention Time-Min 10
Endurance 100000 Write/Erase Cycles JESD-30 Code R-PDSO-N8
Length 6 mm Memory Density 16777216 bit
Memory IC Type FLASH Memory Width 4
Number of Functions 1 Number of Terminals 8
Number of Words 4194304 words Number of Words Code 4000000
Operating Mode SYNCHRONOUS Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C Organization 4MX4
Package Body Material PLASTIC/EPOXY Package Code HVSON
Package Equivalence Code SOLCC8,.25 Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED Power Supplies 1.8 V
Programming Voltage 1.8 V Qualification Status Not Qualified
Seated Height-Max 0.8 mm Serial Bus Type SPI
Standby Current-Max 0.00002 A Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 2 V Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Form NO LEAD Terminal Pitch 1.27 mm
Terminal Position DUAL Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE Width 5 mm
Write Protection HARDWARE/SOFTWARE

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MX25U1635EZNI-10G

WSON package with 8 pins and an access time of 8ns

Inventory:

5,802