• THGBMJG6C1LBAIL BGA
THGBMJG6C1LBAIL BGA

THGBMJG6C1LBAIL

NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin WFBGA Tray

Quantity Unit Price(USD) Ext. Price
1 $4.063 $4.06
10 $3.612 $36.12
30 $3.383 $101.49
152 $2.926 $444.75
456 $2.815 $1,283.64
1064 $2.768 $2,945.15

Inventory:7,597

*The price is for reference only.
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Quick Inquiry

Please submit RFQ for THGBMJG6C1LBAIL or email to us: Email: [email protected], we will contact you in 12 hours.

Overview of THGBMJG6C1LBAIL

The THGBMJG6C1LBAIL is a high-performance eMMC NAND flash memory module designed for embedded applications. It offers reliable data storage and fast read/write speeds, making it ideal for various electronic devices.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VDD: Positive Power Supply
  • VSS: Ground
  • D0-D7: Data I/O Lines
  • CLK: Clock Input
  • CS: Chip Select
  • RST: Reset Pin
  • NC: No Connection

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the THGBMJG6C1LBAIL module for a visual representation.

Key Features

  • High Capacity: The THGBMJG6C1LBAIL offers large storage capacity for storing data-intensive applications.
  • Fast Read/Write Speeds: With high-speed data transfer rates, this eMMC module allows for quick access to stored data.
  • Reliable Performance: Designed for durability and reliability, ensuring data integrity in various operating conditions.
  • Embedded Design: Ideal for use in embedded systems, such as smartphones, tablets, and IoT devices.
  • Temperature Range: Operates effectively within a wide temperature range, suitable for industrial applications.

Note: For detailed technical specifications, please refer to the THGBMJG6C1LBAIL datasheet.

Application

  • Embedded Systems: Suitable for use in embedded systems that require reliable data storage.
  • Mobile Devices: Ideal for smartphones, tablets, and other mobile devices that need high-capacity storage.
  • Industrial Automation: Used in industrial automation applications for storing critical data.

Functionality

The THGBMJG6C1LBAIL eMMC module provides efficient and secure data storage solutions for a wide range of embedded applications, ensuring seamless data access and operation.

Usage Guide

  • Power Supply: Connect VDD (Pin) to the positive power supply and VSS (Pin) to ground.
  • Data Transfer: Use the D0-D7 data lines for transferring data to and from the module.
  • Control Inputs: Utilize the CLK, CS, and RST pins for clock, chip select, and reset functions, respectively.

Frequently Asked Questions

Q: Is the THGBMJG6C1LBAIL compatible with industrial operating temperatures?
A: Yes, the THGBMJG6C1LBAIL is designed to operate effectively within industrial temperature ranges for reliable performance.

THGBMJG6C1LBAIL

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category eMMC RoHS Details
Series THGBM Package / Case FBGA-153
Memory Size 8 GB Configuration MLC
Interface Type eMMC 5.1 Supply Voltage - Min 2.7 V
Supply Voltage - Max 3.6 V Minimum Operating Temperature - 25 C
Maximum Operating Temperature + 85 C Brand Kioxia America
Dimensions 11.5 mm x 13 mm x 0.8 mm Moisture Sensitive Yes
Mounting Style SMD/SMT Product eMMC Flash Drive
Product Type eMMC Factory Pack Quantity 152
Subcategory Memory & Data Storage Unit Weight 0.217191 oz

Warranty & Returns

Warranty, Returns, and Additional Information

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    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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