• THGBMNG5D1LBAIL FBGA-153
THGBMNG5D1LBAIL FBGA-153

THGBMNG5D1LBAIL

The THGBMNG5D1LBAIL is a cutting-edge NAND Flash memory chip and controller, boasting 4GB of storage

Quantity Unit Price(USD) Ext. Price
1 $3.795 $3.80
10 $3.380 $33.80
30 $3.170 $95.10
152 $2.545 $386.84
456 $2.444 $1,114.46
1064 $2.399 $2,552.54

Inventory:6,739

*The price is for reference only.
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Overview of THGBMNG5D1LBAIL

The THGBMNG5D1LBAIL is a high-performance 32Gbit eMMC (embedded MultiMediaCard) flash memory module designed for use in mobile devices, such as smartphones, tablets, and digital cameras. This FLASH - NAND Memory IC provides reliable storage for multimedia content, applications, and system software in a compact form factor.

Pinout

The THGBMNG5D1LBAIL pinout refers to the configuration and function of each pin in its FBGA-153 package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the THGBMNG5D1LBAIL has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • CMD: Command Line
  • CLK: Clock Line
  • DAT0-DAT7: Data Lines
  • VCC: Power Supply
  • VCCQ: I/O Power Supply
  • VSS: Ground
  • NC: No Connection

Circuit Diagram

Incorporate a circuit diagram that illustrates the connections and operation of the THGBMNG5D1LBAIL eMMC module for a more visual representation.

THGBMNG5D1LBAIL

Key Features

  • High Capacity: The THGBMNG5D1LBAIL offers high storage capacity, making it suitable for storing large amounts of data, including multimedia content and applications.
  • High-Speed Interface: This eMMC module features a high-speed interface for fast data transfer, ensuring smooth operation of mobile devices.
  • Reliable Storage: The THGBMNG5D1LBAIL provides reliable storage for critical data, with built-in error correction and wear-leveling algorithms to enhance data integrity and longevity.
  • Compact Form Factor: This module is designed in a compact form factor, making it suitable for integration into small mobile devices without compromising on storage capacity.
  • Wide Operating Temperature Range: The THGBMNG5D1LBAIL is designed to operate over a wide temperature range, ensuring reliable performance in various environmental conditions.
  • Low Power Consumption: Despite its high performance, this eMMC module consumes low power, helping to extend the battery life of mobile devices.

Note: For detailed technical specifications, refer to the THGBMNG5D1LBAIL datasheet.

Application

  • Mobile Devices: The THGBMNG5D1LBAIL is ideal for use in mobile devices such as smartphones, tablets, and digital cameras, providing reliable storage for multimedia content and applications.
  • Automotive Infotainment: This eMMC module can be used in automotive infotainment systems, providing storage for multimedia content and navigation data.
  • Industrial Applications: The THGBMNG5D1LBAIL is suitable for use in industrial applications requiring reliable storage for data logging and system software.
  • Consumer Electronics: This module can be used in various consumer electronics applications requiring high-capacity and reliable storage.

Functionality

The THGBMNG5D1LBAIL eMMC module provides reliable, high-capacity storage for mobile devices, ensuring smooth operation and data integrity.

Usage Guide

  • Power Supply: Connect VCC (Pin 4) to the power supply and VSS (Pin 7) to ground.
  • Interface Connections: Connect CMD, CLK, and DAT0-DAT7 to the corresponding lines on the host device for data transfer.
  • I/O Power Supply: Connect VCCQ (Pin 5) to the I/O power supply for the data lines.

Advantages and Disadvantages

Advantages

  • High Storage Capacity: Provides ample space for data storage.
  • Fast Data Transfer: Ensures quick read and write operations for efficient data management.
  • Energy Efficient: Low power consumption is ideal for battery-operated devices.
  • Reliable Performance: Ensures dependable operation in demanding environments.

Disadvantages

  • Complex Integration: Requires careful design consideration to utilize all features effectively.
  • Cost: Higher cost compared to simpler storage solutions due to advanced functionalities.

Frequently Asked Questions

Q: What is the difference between eMMC and traditional SD cards?
A: eMMC modules integrate the flash memory and controller into a single package, offering higher performance and reliability compared to traditional SD cards, which use separate components for storage and processing.

Q: How does the THGBMNG5D1LBAIL improve system performance in mobile devices?
A: The THGBMNG5D1LBAIL provides high-speed data transfer and reliable storage, ensuring the smooth operation of mobile devices and improved system performance.

Q: What is the primary function of the THGBMNG5D1LBAIL?
A: The THGBMNG5D1LBAIL is designed for high-performance embedded storage, providing efficient data management and reliable performance in various electronic systems.

Q: What are the primary applications of the THGBMNG5D1LBAIL?
A: The THGBMNG5D1LBAIL is used in mobile devices, embedded systems, industrial equipment, and consumer electronics.

Q: How should the THGBMNG5D1LBAIL be integrated into a system?
A: Connect the power supply, ground, and signal interfaces as specified in the datasheet. Ensure proper connections and follow the guidelines for optimal performance.

Q: Can the THGBMNG5D1LBAIL be interchanged with other eMMCs?
A: Yes, it can be interchanged with other eMMCs with similar electrical characteristics, provided that the mechanical and thermal specifications are met.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category eMMC RoHS Details
Package / Case FBGA-153 Memory Size 4 GB
Minimum Operating Temperature - 25 C Maximum Operating Temperature + 85 C
Brand Kioxia America Moisture Sensitive Yes
Mounting Style SMD/SMT Product eMMC Flash Drive
Product Type eMMC Factory Pack Quantity 152
Subcategory Memory & Data Storage Unit Weight 0.173752 oz

Equivalent Parts

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

THGBMNG5D1LBAIL Equivalent Parts

For the THGBMNG5D1LBAIL component, you may consider these replacement and alterative parts.

Models Manufacturer Package/Case Description
THGBMTG5D1LBAIL Kioxia America, Inc. BGA FLASH - NAND Memory IC 32Gbit eMMC_5 200 MHz 153-BGA (11.5x13)
THGBM3G5D1FBAIEH2H Toshiba BGA NAND flash memory IC

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THGBMNG5D1LBAIL

The THGBMNG5D1LBAIL is a cutting-edge NAND Flash memory chip and controller, boasting 4GB of storage

Inventory:

6,739