• CYUSB3014-BZXI 121-FBGA (10x10)
CYUSB3014-BZXI 121-FBGA (10x10)

CYUSB3014-BZXI

IC ARM9 USB CONTROLLER 121FBGA

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  • Part Number : CYUSB3014-BZXI

  • Package/Case : 121-FBGA (10x10)

  • Brands : Cypress Semiconductor Corp

  • Components Categories : Application Specific Microcontrollers

  • Datesheet : CYUSB3014-BZXI DataSheet (PDF)

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Technical Attributes

Functional DescriptionFor a complete list of related documentation, click here.Features■ Universal serial bus (USB) integration ❐ USB 3.1, Gen 1 and USB 2.0 peripherals compliant with USB 3.1 Specification Revision 1.0 (TID # 340800007) ❐ 5-Gbps SuperSpeed PHY compliant with USB 3.1 Gen 1 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0 ❐ Thirty-two physical endpoints ❐ Support for battery charging Specification 1.1 and accessory charger adaptor (ACA) detection■ General Programmable Interface (GPIF™ II) ❐ Programmable 100-MHz GPIF II enables connectivity to a wide range of external devices ❐ 8-, 16-, 24-, and 32-bit data bus ❐ Up to16 configurable control signals■ Fully accessible 32-bit CPU ❐ ARM926EJ core with 200-MHz operation ❐ 512-KB or 256-KB embedded SRAM■ Additional connectivity to the following peripherals ❐ SPI master at up to 33 MHz ❐ UART support of up to 4 Mbps ❐ I2C master controller at 1 MHz ❐ I2S master (transmitter only) at sampling frequencies of 32 kHz, 44.1 kHz, and 48 kHz■ Selectable clock input frequencies ❐ 19.2, 26, 38.4, and 52 MHz ❐ 19.2-MHz crystal input support■ Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off■ Independent power domains for core and I/O ❐ Core operation at 1.2 V ❐ I2S, UART, and SPI operation at 1.8 to 3.3 V ❐ I2C operation at 1.2 V to 3.3 V■ Package options ❐ 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA) ❐ 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale package (WLCSP) ❐ See Table 20 for details on the eight FX3 variants■ EZ-USB® Software Development Kit (SDK) for code development of firmware and PC Applications ❐ Includes RTOS Framework (using ThreadX Version 5) ❐ Firmware examples covering all I/O modules ❐ Visual Studio host examples using C++ and C#■ SuperSpeed Explorer Board available for rapid prototyping ❐ Several accessory boards also available: • Adapter boards for Xilinx/Altera FPGA development • Adapter board for Video development • CPLD board for concept testing and initial developmentApplications■ Digital video camcorders■ Digital still cameras■ Printers■ Scanners■ Video capture cards■ Test and measurement equipment■ Surveillance cameras■ Personal navigation devices■ Medical imaging devices■ Video IP phones■ Portable media players■ Industrial cameras■ Data loggers■ Data acquisition■ High-performance Human Interface Devices (gesture recognition)

CYUSB3014-BZXI

Key Features

  • Universal serial bus (USB) integration
  • ❐ USB 3.1, Gen 1 and USB 2.0 peripherals compliant with USB 3.1 Specification Revision 1.0 (TID # 340800007)
  • ❐ 5-Gbps SuperSpeed PHY compliant with USB 3.1 Gen 1
  • ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
  • ❐ Thirty-two physical endpoints
  • ❐ Support for battery charging Specification 1.1 and accessory charger adaptor (ACA) detection
  • General Programmable Interface (GPIF™ II)
  • ❐ Programmable 100-MHz GPIF II enables connectivity to a wide range of external devices
  • ❐ 8-, 16-, 24-, and 32-bit data bus
  • ❐ Up to16 configurable control signals
  • Fully accessible 32-bit CPU
  • ❐ ARM926EJ core with 200-MHz operation
  • ❐ 512-KB or 256-KB embedded SRAM
  • Additional connectivity to the following peripherals
  • ❐ SPI master at up to 33 MHz
  • ❐ UART support of up to 4 Mbps
  • ❐ I2C master controller at 1 MHz
  • ❐ I2S master (transmitter only) at sampling frequencies of 32 kHz, 44.1 kHz, and 48 kHz
  • Selectable clock input frequencies
  • ❐ 19.2, 26, 38.4, and 52 MHz
  • ❐ 19.2-MHz crystal input support
  • Ultra low-power in core power-down mode
  • ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off
  • Independent power domains for core and I/O
  • ❐ Core operation at 1.2 V
  • ❐ I2S, UART, and SPI operation at 1.8 to 3.3 V
  • ❐ I2C operation at 1.2 V to 3.3 V
  • Package options
  • ❐ 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA)
  • ❐ 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale package (WLCSP)
  • ❐ See Table 20 for details on the eight FX3 variants
  • EZ-USB® Software Development Kit (SDK) for code development of firmware and PC Applications
  • ❐ Includes RTOS Framework (using ThreadX Version 5)
  • ❐ Firmware examples covering all I/O modules
  • ❐ Visual Studio host examples using C++ and C#
  • SuperSpeed Explorer Board available for rapid prototyping
  • ❐ Several accessory boards also available:
  • Adapter boards for Xilinx/Altera FPGA development
  • Adapter board for Video development
  • CPLD board for concept testing and initial development

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Category Integrated Circuits (ICs)EmbeddedApplication Specific Microcontrollers Mfr Infineon Technologies
Series EZ-USB FX3™ Package Tray
Product Status Active Digi-Key Programmable Not Verified
Applications SuperSpeed USB Peripheral Controller Core Processor ARM9®
Program Memory Type External Program Memory Controller Series CYUSB
RAM Size 512K x 8 Interface GPIF, I²C, I²S, SPI, UART, USB
Number of I/O 60 Voltage - Supply 1.15V ~ 1.25V
Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount
Package / Case 121-TFBGA Supplier Device Package 121-FBGA (10x10)
Base Product Number CYUSB3014

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