CYUSB3014-BZXI
IC ARM9 USB CONTROLLER 121FBGA






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Part Number : CYUSB3014-BZXI
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Package/Case : 121-FBGA (10x10)
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Brands : Cypress Semiconductor Corp
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Components Categories : Application Specific Microcontrollers
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Datesheet : CYUSB3014-BZXI DataSheet (PDF)
Technical Attributes
Functional DescriptionFor a complete list of related documentation, click here.Features■ Universal serial bus (USB) integration ❐ USB 3.1, Gen 1 and USB 2.0 peripherals compliant with USB 3.1 Specification Revision 1.0 (TID # 340800007) ❐ 5-Gbps SuperSpeed PHY compliant with USB 3.1 Gen 1 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0 ❐ Thirty-two physical endpoints ❐ Support for battery charging Specification 1.1 and accessory charger adaptor (ACA) detection■ General Programmable Interface (GPIF™ II) ❐ Programmable 100-MHz GPIF II enables connectivity to a wide range of external devices ❐ 8-, 16-, 24-, and 32-bit data bus ❐ Up to16 configurable control signals■ Fully accessible 32-bit CPU ❐ ARM926EJ core with 200-MHz operation ❐ 512-KB or 256-KB embedded SRAM■ Additional connectivity to the following peripherals ❐ SPI master at up to 33 MHz ❐ UART support of up to 4 Mbps ❐ I2C master controller at 1 MHz ❐ I2S master (transmitter only) at sampling frequencies of 32 kHz, 44.1 kHz, and 48 kHz■ Selectable clock input frequencies ❐ 19.2, 26, 38.4, and 52 MHz ❐ 19.2-MHz crystal input support■ Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off■ Independent power domains for core and I/O ❐ Core operation at 1.2 V ❐ I2S, UART, and SPI operation at 1.8 to 3.3 V ❐ I2C operation at 1.2 V to 3.3 V■ Package options ❐ 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA) ❐ 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale package (WLCSP) ❐ See Table 20 for details on the eight FX3 variants■ EZ-USB® Software Development Kit (SDK) for code development of firmware and PC Applications ❐ Includes RTOS Framework (using ThreadX Version 5) ❐ Firmware examples covering all I/O modules ❐ Visual Studio host examples using C++ and C#■ SuperSpeed Explorer Board available for rapid prototyping ❐ Several accessory boards also available: • Adapter boards for Xilinx/Altera FPGA development • Adapter board for Video development • CPLD board for concept testing and initial developmentApplications■ Digital video camcorders■ Digital still cameras■ Printers■ Scanners■ Video capture cards■ Test and measurement equipment■ Surveillance cameras■ Personal navigation devices■ Medical imaging devices■ Video IP phones■ Portable media players■ Industrial cameras■ Data loggers■ Data acquisition■ High-performance Human Interface Devices (gesture recognition)

Key Features
- Universal serial bus (USB) integration
- ❐ USB 3.1, Gen 1 and USB 2.0 peripherals compliant with USB 3.1 Specification Revision 1.0 (TID # 340800007)
- ❐ 5-Gbps SuperSpeed PHY compliant with USB 3.1 Gen 1
- ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
- ❐ Thirty-two physical endpoints
- ❐ Support for battery charging Specification 1.1 and accessory charger adaptor (ACA) detection
- General Programmable Interface (GPIF™ II)
- ❐ Programmable 100-MHz GPIF II enables connectivity to a wide range of external devices
- ❐ 8-, 16-, 24-, and 32-bit data bus
- ❐ Up to16 configurable control signals
- Fully accessible 32-bit CPU
- ❐ ARM926EJ core with 200-MHz operation
- ❐ 512-KB or 256-KB embedded SRAM
- Additional connectivity to the following peripherals
- ❐ SPI master at up to 33 MHz
- ❐ UART support of up to 4 Mbps
- ❐ I2C master controller at 1 MHz
- ❐ I2S master (transmitter only) at sampling frequencies of 32 kHz, 44.1 kHz, and 48 kHz
- Selectable clock input frequencies
- ❐ 19.2, 26, 38.4, and 52 MHz
- ❐ 19.2-MHz crystal input support
- Ultra low-power in core power-down mode
- ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off
- Independent power domains for core and I/O
- ❐ Core operation at 1.2 V
- ❐ I2S, UART, and SPI operation at 1.8 to 3.3 V
- ❐ I2C operation at 1.2 V to 3.3 V
- Package options
- ❐ 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA)
- ❐ 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale package (WLCSP)
- ❐ See Table 20 for details on the eight FX3 variants
- EZ-USB® Software Development Kit (SDK) for code development of firmware and PC Applications
- ❐ Includes RTOS Framework (using ThreadX Version 5)
- ❐ Firmware examples covering all I/O modules
- ❐ Visual Studio host examples using C++ and C#
- SuperSpeed Explorer Board available for rapid prototyping
- ❐ Several accessory boards also available:
- Adapter boards for Xilinx/Altera FPGA development
- Adapter board for Video development
- CPLD board for concept testing and initial development
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Category | Integrated Circuits (ICs)EmbeddedApplication Specific Microcontrollers | Mfr | Infineon Technologies |
Series | EZ-USB FX3™ | Package | Tray |
Product Status | Active | Digi-Key Programmable | Not Verified |
Applications | SuperSpeed USB Peripheral Controller | Core Processor | ARM9® |
Program Memory Type | External Program Memory | Controller Series | CYUSB |
RAM Size | 512K x 8 | Interface | GPIF, I²C, I²S, SPI, UART, USB |
Number of I/O | 60 | Voltage - Supply | 1.15V ~ 1.25V |
Operating Temperature | -40°C ~ 85°C | Mounting Type | Surface Mount |
Package / Case | 121-TFBGA | Supplier Device Package | 121-FBGA (10x10) |
Base Product Number | CYUSB3014 |
Warranty & Returns
Warranty, Returns, and Additional Information
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QA & Return Policy
Parts Quality Guarantee: 365 days
Returns for refund: within 90 days
Returns for Exchange: within 90 days
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Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.
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