RT3050F
(RT3050 / RT3052) high performance 384MHz MIPS24KEc CPU core
Inventory:7,633
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Part Number : RT3050F
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Package/Case : BGA
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Brands : MEDIATEK
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Components Categories : Other uPs/uCs/Peripheral ICs
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Datesheet : RT3050F DataSheet (PDF)
The RT3050F is a highly integrated system-on-chip (SoC) designed for wireless communication applications. This SoC combines a high-performance processor, wireless connectivity, and various interfaces, making it ideal for IoT and networking solutions. (Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.) Include a circuit diagram illustrating the connections and operation of the RT3050F SoC for a visual representation. Note: For detailed technical specifications, please refer to the RT3050F datasheet. Functionality The RT3050F SoC combines processing power and wireless connectivity, enabling seamless communication and networking in various applications. Usage Guide Q: Can the RT3050F be used in battery-powered IoT devices? Q: What wireless standards are supported by the RT3050F? For similar functionalities, consider these alternatives to the RT3050F:Overview of RT3050F
Pinout
Circuit Diagram
Key Features
Application
Frequently Asked Questions
A: Yes, the RT3050F's low power consumption makes it suitable for battery-powered IoT applications requiring wireless connectivity.
A: The RT3050F supports Wi-Fi connectivity based on standard wireless protocols.Equivalent
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | Contact Manufacturer |
Ihs Manufacturer | MEDIATEK INC | Package Description | LFBGA, |
Reach Compliance Code | HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Mediatek | JESD-30 Code | S-PBGA-B289 |
Length | 14 mm | Number of Terminals | 289 |
Operating Temperature-Max | 55 °C | Operating Temperature-Min | -10 °C |
Package Body Material | PLASTIC/EPOXY | Package Code | LFBGA |
Package Shape | SQUARE | Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | Seated Height-Max | 1.4 mm |
Supply Voltage-Max | 1.26 V | Supply Voltage-Min | 1.14 V |
Supply Voltage-Nom | 1.2 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | COMMERCIAL |
Terminal Form | BALL | Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 14 mm | uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
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Warranty, Returns, and Additional Information
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Parts Quality Guarantee: 365 days
Returns for refund: within 90 days
Returns for Exchange: within 90 days
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