MT7620A
Integrated 802.11n MAC/BBP and 2.4 GHz RF/FEM Router-on-a-Chip TFBGA 265 ball (11 mm x 11 mm)
Inventory:8,225
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Part Number : MT7620A
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Package/Case : BGA
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Brands : MEDIATEK
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Components Categories : Other uPs/uCs/Peripheral ICs
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Datesheet : MT7620A DataSheet (PDF)
The MT7620A is a highly integrated System-on-Chip (SoC) designed for wireless networking applications. It features a 580MHz MIPS 24KEc CPU, providing robust processing power for various networking tasks. This SoC is commonly used in Wi-Fi routers, access points, and other wireless devices. (Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.) Include a circuit diagram illustrating the connections and operation of the MT7620A SoC for a visual representation. Note: For detailed technical specifications, please refer to the MT7620A datasheet. Functionality The MT7620A SoC integrates processing power, wireless connectivity, and various I/O interfaces to enable efficient networking functionality in a single chip. It offers a reliable solution for wireless networking applications. Usage Guide Q: What is the maximum operating frequency of the MT7620A CPU? Q: Can the MT7620A support dual-band Wi-Fi connectivity? For similar functionalities, consider these alternatives to the MT7620A:Overview of MT7620A
Pinout
Circuit Diagram
Key Features
Application
Frequently Asked Questions
A: The MT7620A CPU operates at a maximum frequency of 580MHz, providing high-speed processing capabilities.
A: Yes, the MT7620A can support dual-band Wi-Fi connectivity for enhanced wireless networking performance.Equivalent
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | Contact Manufacturer |
Ihs Manufacturer | MEDIATEK INC | Package Description | TFBGA, |
Reach Compliance Code | HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Mediatek | JESD-30 Code | S-PBGA-B265 |
Length | 11 mm | Number of Terminals | 265 |
Operating Temperature-Max | 55 °C | Operating Temperature-Min | -20 °C |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Shape | SQUARE | Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | Seated Height-Max | 1.2 mm |
Supply Voltage-Max | 1.33 V | Supply Voltage-Min | 1.2 V |
Supply Voltage-Nom | 1.27 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | OTHER |
Terminal Form | BALL | Terminal Pitch | 0.65 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 11 mm | uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Warranty & Returns
Warranty, Returns, and Additional Information
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QA & Return Policy
Parts Quality Guarantee: 365 days
Returns for refund: within 90 days
Returns for Exchange: within 90 days
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