K4X1G323PF-8GD8
DRAM Chip Mobile-DDR SDRAM 1Gbit 32Mx32 1.8V 90-Pin FBGA
Inventory:5,327
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Part Number : K4X1G323PF-8GD8
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Package/Case : FBGA
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Brands : Samsung Electronics
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Components Categories : DRAM Chip
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Datesheet : K4X1G323PF-8GD8 DataSheet (PDF)
Overview of K4X1G323PF-8GD8
Key Features
1.8V power supply, 1.8V I/O power
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Four banks operation
1 /CS
1 CKE
Differential clock inputs(CK and CK)
MRS cycle with address key programs
- CAS Latency ( 2, 3 )
- Burst Length ( 2, 4, 8, 16 )
- Burst Type (Sequential & Interleave)
- Partial Self Refresh Type ( Full, 1/2, 1/4 Array )
- Output Driver Strength Control ( Full, 1/2, 1/4, 1/8 )
Internal Temperature Compensated Self Refresh
Deep Power Down Mode
All inputs except data & DM are sampled at the positive going edge of the system clock(CK).
Data I/O transactions on both edges of data strobe, DM for masking.
Edge aligned data output, center aligned data input.
No DLL; CK to DQS is not synchronized.
LDM, UDM for write masking only.
Auto refresh duty cycle
- 7.8us for -25 to 85 C
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
ECCN (US) | EAR99 | Part Status | Unconfirmed |
Automotive | No | PPAP | No |
DRAM Type | Mobile-DDR SDRAM | Chip Density (bit) | 1G |
Organization | 32Mx32 | Number of Bits/Word (bit) | 32 |
Data Bus Width (bit) | 32 | Maximum Clock Rate (MHz) | 800 |
Number of I/O Lines (bit) | 32 | Mounting | Surface Mount |
PCB changed | 90 | Standard Package Name | BGA |
Supplier Package | FBGA | Pin Count | 90 |
Lead Shape | Ball |
Warranty & Returns
Warranty, Returns, and Additional Information
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QA & Return Policy
Parts Quality Guarantee: 365 days
Returns for refund: within 90 days
Returns for Exchange: within 90 days
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