• K4B1G1646G-BCH9 FBGA96
K4B1G1646G-BCH9 FBGA96

K4B1G1646G-BCH9

DDR DRAM, 64MX16, 0.255ns, CMOS, PBGA96

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Overview of K4B1G1646G-BCH9

The K4B1G1646G-BCH9 is a 1Gb DDR3 SDRAM chip designed for high-performance computing and memory-intensive applications. It offers a high-speed data transfer rate and low power consumption, making it ideal for use in various electronic devices.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VDD: Power Supply
  • DQ: Data Input/Output
  • DM: Data Mask
  • CK: Clock Input
  • CS: Chip Select
  • CA: Address Bus
  • RESET: Reset Pin
  • RP: Row Precharge
  • RAS: Row Address Strobe
  • CAS: Column Address Strobe
  • WE: Write Enable
  • BA: Bank Address
  • LDQS/LDQS: Data Strobe
  • ODT: On-Die Termination
  • CKE: Clock Enable
  • CS: Chip Select

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the K4B1G1646G-BCH9 DDR3 SDRAM for a visual representation.

Key Features

  • 1Gb DDR3 SDRAM: Provides high-density memory storage for efficient data processing.
  • High-Speed Data Transfer: Offers fast data transfer rates, suitable for demanding computing tasks.
  • Low Power Consumption: Features low power requirements for energy-efficient operation.
  • Wide Operating Voltage Range: Supports a range of supply voltages for compatibility with different systems.
  • Data Mask Functionality: Includes data mask pins for data validation and integrity.
  • On-Die Termination: Integrated on-die termination for signal integrity and noise reduction.

Note: For detailed technical specifications, please refer to the K4B1G1646G-BCH9 datasheet.

Application

  • Computer Systems: Suitable for use in computer systems, laptops, and servers requiring high-speed memory.
  • Networking Devices: Ideal for networking devices and routers to enhance data processing capabilities.
  • Embedded Systems: Used in embedded systems and industrial applications for reliable data storage and retrieval.

Functionality

The K4B1G1646G-BCH9 DDR3 SDRAM chip offers high-density memory storage with fast data transfer speeds and low power consumption, making it a reliable choice for various computing and electronic applications.

Usage Guide

  • Power Supply: Connect VDD (Pin 1) to the power supply voltage within the specified range.
  • Data Connections: Use DQ pins for data input and output operations.
  • Clock Input: Apply the clock signal to the CK pin for synchronized data processing.
  • Addressing: Use the CA pins for addressing memory locations in the chip.

Frequently Asked Questions

Q: Is the K4B1G1646G-BCH9 compatible with DDR4 systems?
A: No, the K4B1G1646G-BCH9 is a DDR3 SDRAM chip and is not compatible with DDR4 systems.

Equivalent

For similar functionalities, consider these alternatives to the K4B1G1646G-BCH9:

  • MT47H64M16HR-3:H Micron DDR3 SDRAM chip offering comparable performance specifications.
  • NT5CC256M16DP-DI: Nanya DDR3 SDRAM with similar capacity and features.

K4B1G1646G-BCH9

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) EAR99 Part Status Obsolete
Automotive No PPAP No
DRAM Type DDR3 SDRAM Chip Density (bit) 1G
Organization 64Mx16 Number of Internal Banks 8
Number of Words per Bank 8M Number of Bits/Word (bit) 16
Data Bus Width (bit) 16 Maximum Clock Rate (MHz) 1333
Maximum Access Time (ns) 0.255 Address Bus Width (bit) 16
Interface Type SSTL_1.5 Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5 Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 120 Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95 Number of I/O Lines (bit) 16
Mounting Surface Mount Package Height 0.75
Package Width 7.5 Package Length 13.3
PCB changed 96 Standard Package Name BGA
Supplier Package FBGA Pin Count 96
Lead Shape Ball

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