MT29F512G08 (5)
The MT29F512G08 is available from Micron at Xecor. Designed for high-capacity data storage and fast data transfer, the MT29F512G08 offers 512Gbit of NAND flash memory with a parallel interface, operating at a clock frequency of 333 MHz. Its low power consumption (2.5V ~ 3.6V) and wide operating temperature range (-40°C ~ 85°C) make it suitable for demanding environments. Available in a 132-VBGA package (12x18), it is ideal for applications in data centers, industrial automation, and embedded systems. Whether used in enterprise storage solutions, telecommunications, or automotive electronics, this series ensures reliable performance, scalability, and efficiency for high-performance applications. Xecor is an authorized distributor for Micron Please view our extensive selection of the MT29F512G08 series below.
Part Number | Description | Package | Inventory | Add To Bom |
---|---|---|---|---|
MT29F512G08AUCBBH8-6IT:B | Plastic NAND Flash 64Gx8 | LBGA-152 | 8,178 | |
MT29F512G08CUCABH3-10ITZ:A | Low profile height of 1.40mm | LBGA-100 | 6,792 | |
MT29F512G08CUCDBJ6-6R:D | 4G-bit 512M x 8 | 132-LBGA | 8,238 | |
MT29F512G08CMCEBJ4-37ITR:E | NAND Flash Memory Module | 132-VBGA | 6,155 | |
MT29F512G08CKECBH7-12:C | Operating voltage of 3.3V for efficient power management | 152-TBGA | 9,131 |
Key Featrues
Parallel Interface for High-Speed Data Transfer: The memory interface is parallel, enabling faster data transfer rates compared to serial interfaces. This is particularly beneficial for applications that demand high-speed data processing, such as real-time data logging, video streaming, and high-resolution imaging systems.
Wide Operating Temperature Range: Operating within a temperature range of -40°C to 85°C (TA), this memory IC is suitable for use in harsh environments, including industrial automation, automotive systems, and outdoor equipment, ensuring reliable performance under extreme conditions.
Low Power Consumption: The voltage supply range of 2.5V to 3.6V indicates low power consumption, which is crucial for battery-powered devices and energy-efficient applications, such as portable electronics, wearables, and IoT sensors.
Compact Surface Mount Package: The 132-VBGA (12x18) package is designed for surface mounting, offering a compact form factor that saves space on the PCB. This is advantageous for space-constrained applications like mobile devices, embedded systems, and compact consumer electronics.
Applications
Embedded Systems with Large Memory Requirements: This 512Gbit NAND flash memory is perfect for embedded systems requiring large storage capacities, such as IoT devices, automotive infotainment systems, and medical equipment. Its TLC (Triple-Level Cell) technology provides a cost-effective solution for high-density storage, while the 132-VBGA package ensures compact integration into space-constrained designs. The non-volatile nature of the memory ensures data retention even during power outages.
High-Performance Computing and Data Centers: The MT29F512G08 is well-suited for high-performance computing applications and data centers, where large-scale data storage and fast access are critical. Its parallel memory interface and high clock frequency support efficient data handling, making it ideal for caching, buffering, and temporary storage in servers and storage arrays. The 2.5V to 3.6V supply voltage range ensures compatibility with modern computing architectures.
Consumer Electronics with Advanced Storage Needs: This NAND flash memory is an excellent choice for consumer electronics such as gaming consoles, smart TVs, and high-end smartphones, where large storage capacities and fast data access are essential. Its TLC technology balances performance and cost, making it suitable for mass-market devices. The surface-mount 132-VBGA package allows for easy integration into compact consumer devices, while the wide operating temperature range ensures durability in various usage scenarios.
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