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XCZU47DR-2FFVG1517I

High-performance processing unit

Inventory:5,012

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Overview of XCZU47DR-2FFVG1517I

The XCZU47DR-2FFVG1517I is a Xilinx Zynq UltraScale+ MPSoC optimized for high-speed and low-voltage operations, providing excellent performance for industrial automation, embedded systems, communications equipment, medical devices, automotive applications, robotics, aerospace, defense, image and video processing, data center acceleration, and more.

Pinout

The XCZU47DR-2FFVG1517I pinout refers to the configuration and function of each pin in its 1517-BBGA package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the XCZU47DR-2FFVG1517I has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • Xilinx Zynq UltraScale+ MPSoC: Combines a dual-core ARM Cortex-A53 processor with a Mali-400 MP2 GPU, 32 programmable logic units, and 4 execution units for efficient processing.
  • 2GB DDR4 memory: Provides ample storage for data-intensive applications.
  • 64-bit quad-core processor: Offers improved performance and power efficiency.
  • 1517 I/Os: Enables high-speed communication with peripherals and other devices.
  • 4.8 Mb of UltraRAM: Provides fast access to frequently used data.
  • Support for PCIe Gen3 x16, USB 2.0, Gigabit Ethernet, and more: Enables connectivity with a wide range of peripherals and devices.

Applications

  • Industrial automation: The XCZU47DR-2FFVG1517I is suitable for industrial control systems, robotics, and other applications that require high-speed processing and low-power consumption.
  • Embedded systems: This device can be used in a variety of embedded systems, including automotive, medical devices, and aerospace applications.
  • Communications equipment: The XCZU47DR-2FFVG1517I is suitable for telecommunications equipment, such as routers, switches, and gateways.
  • Medical devices: This device can be used in medical devices that require high-speed processing and low-power consumption, such as ultrasound machines and MRI scanners.
  • Automotive applications: The XCZU47DR-2FFVG1517I is suitable for automotive applications, including autonomous vehicles, infotainment systems, and advanced driver-assistance systems (ADAS).
  • Robotics: This device can be used in robotics applications that require high-speed processing and low-power consumption, such as robotic arms and autonomous mobile robots.
  • Aerospace: The XCZU47DR-2FFVG1517I is suitable for aerospace applications, including satellite systems, spacecraft, and aircraft.
  • Data center acceleration: This device can be used to accelerate data processing in data centers, cloud computing environments, and other high-performance computing applications.

Advantages and Disadvantages

The XCZU47DR-2FFVG1517I offers several advantages, including:

  • High-speed processing: The device's dual-core ARM Cortex-A53 processor and Mali-400 MP2 GPU enable high-speed processing for demanding applications.
  • Low-power consumption: The XCZU47DR-2FFVG1517I is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is critical.
  • High-performance memory: The device's 2GB DDR4 memory and 4.8 Mb of UltraRAM provide fast access to frequently used data.
  • Wide range of interfaces: The XCZU47DR-2FFVG1517I supports a wide range of interfaces, including PCIe Gen3 x16, USB 2.0, Gigabit Ethernet, and more.

However, the device also has some disadvantages:

  • Complexity: The XCZU47DR-2FFVG1517I is a complex device that requires significant expertise to design and implement effectively.
  • Cost: The device's high-performance capabilities come at a cost, making it more expensive than some other options on the market.
  • Power consumption: While the XCZU47DR-2FFVG1517I is designed to consume low power, it still requires a significant amount of power to operate effectively.

Equivalents

If you're looking for alternatives to the XCZU47DR-2FFVG1517I, here are some equivalents:

  • NVIDIA Jetson Xavier: A high-performance AI computing platform that offers similar capabilities to the XCZU47DR-2FFVG1517I.
  • Intel Cyclone V SoC: A system-on-chip (SoC) that combines a dual-core ARM Cortex-A9 processor with a FPGA for high-speed processing and low-power consumption.
  • Qualcomm Snapdragon 820: A high-performance mobile processor that offers similar capabilities to the XCZU47DR-2FFVG1517I, but is designed specifically for mobile devices.

Frequently Asked Questions

Q: What is the XCZU47DR-2FFVG1517I used for?
A: The XCZU47DR-2FFVG1517I is a high-performance MPSoC that can be used in a variety of applications, including industrial automation, embedded systems, communications equipment, medical devices, automotive applications, robotics, aerospace, and data center acceleration.

Q: What are the advantages of the XCZU47DR-2FFVG1517I?
A: The XCZU47DR-2FFVG1517I offers several advantages, including high-speed processing, low-power consumption, high-performance memory, and a wide range of interfaces.

Q: What are the disadvantages of the XCZU47DR-2FFVG1517I?
A: The XCZU47DR-2FFVG1517I has some disadvantages, including complexity, cost, and power consumption.

Q: Are there any equivalents to the XCZU47DR-2FFVG1517I?
A: Yes, there are several alternatives to the XCZU47DR-2FFVG1517I, including the NVIDIA Jetson Xavier, Intel Cyclone V SoC, and Qualcomm Snapdragon 820.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series Zynq® UltraScale+™ RFSoC Packaging Tray
Part Status Active Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ RAM Size 256KB
Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.333GHz Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40) Number of I/O 561

Warranty & Returns

Warranty, Returns, and Additional Information

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    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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XCZU47DR-2FFVG1517I

High-performance processing unit

Inventory:

5,012