XC7Z035-1FBG676C
Versatile and powerful chip
Inventory:8,589
- 90-day after-sales guarantee
- 365 Days Quality Guarantee
- Genuine Product Guarantee
- 7*24 hours service quarantee
-
Part Number : XC7Z035-1FBG676C
-
Package/Case : FCBGA-676
-
Manufacturer : XILINX
-
Components Classification : System On Chip
-
Datesheet : XC7Z035-1FBG676C DataSheet (PDF)
-
Series : XC7Z035
Overview of XC7Z035-1FBG676C
The XC7Z035-1FBG676C is a System-on-Chip (SoC) optimized for low-power, high-performance, and wide connectivity options. It provides excellent performance for various applications that require efficient processing and memory handling.
Pinout
The XC7Z035-1FBG676C pinout refers to the configuration and function of each pin in its FCBGA-676(27x27) package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the XC7Z035-1FBG676C has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.
Features
- Lov-power: The XC7Z035-1FBG676C offers low power consumption for efficient operation in various applications.
- 140 DSP slices: This SoC features 140 digital signal processing (DSP) slices for high-performance signal processing and analysis.
- LPDDR2 interface: The XC7Z035-1FBG676C supports LPDDR2 memory interface for efficient data transfer and processing.
- High-performance processor: This SoC includes a high-performance processor for efficient execution of complex algorithms and tasks.
- 67,000 slices: The XC7Z035-1FBG676C has 67,000 logic elements (slices) for implementing various digital functions and interfaces.
- Wide connectivity options: This SoC provides wide connectivity options including DDR3L support for diverse memory interfaces.
Applications
- Sensors and controls: The XC7Z035-1FBG676C is suitable for sensors and control systems that require efficient data processing and analysis.
- Wireless applications: This SoC can be used in various wireless applications such as GPS tracking, remote control systems, and wireless communication networks.
- Power management: The XC7Z035-1FBG676C is suitable for power management systems that require efficient energy consumption and optimization.
Advantages and Disadvantages
Advantages
- Low-power architecture: The XC7Z035-1FBG676C is designed for low power consumption, making it suitable for applications that require efficient energy utilization.
- High-performance processing capabilities: This SoC features a high-performance processor for efficiently executing complex algorithms and tasks.
- Suitable for diverse applications: The XC7Z035-1FBG676C is designed to support various applications, including sensors and controls, wireless communication systems, and power management systems.
Disadvantages
- Complex programming requirements: Implementing the XC7Z035-1FBG676C requires advanced programming skills and knowledge of its architecture and interfaces.
- Limited availability of compatible software tools: The development environment for the XC7Z035-1FBG676C may be limited, which can make it difficult to find compatible software tools and platforms.
Equivalents
For similar functionalities, consider these alternatives to the XC7Z035-1FBG676C:
- Zynq-7000 SoC: This SoC is a low-power, high-performance alternative for various applications.
- Arriia i.MX 8 series: These processors offer efficient processing and memory handling capabilities similar to the XC7Z035-1FBG676C.
- Tegra X1 processor: This processor features advanced AI capabilities, suitable for applications that require intelligent image or data analysis.
Frequently Asked Questions
Q: What is the maximum processor frequency of the XC7Z035-1FBG676C?
A: The maximum processor frequency is specified as 1.2 GHz, but it can be adjusted depending on specific application requirements.
Q: Can I use the XC7Z035-1FBG676C for Linux-based applications?
A: Yes, this SoC supports various operating systems, including Linux, making it suitable for a wide range of applications.
Q: Are there any specific design considerations for using the XC7Z035-1FBG676C in power management applications?
A: Yes, when designing power management applications with this SoC, consider optimizing clock signals and configuring memory interfaces to minimize power consumption.
Q: Can I use the XC7Z035-1FBG676C for machine learning or AI-based applications?
A: Yes, this SoC features dedicated acceleration engines for matrix arithmetic operations, making it suitable for various machine learning and AI-related applications.

Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Series | XC7Z035 | Product Status | Active |
Architecture | MCU, FPGA | Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
RAM Size | 256KB | Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Speed | 667MHz |
Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells | Operating Temperature | 0°C ~ 85°C (TJ) |
Package / Case | FCBGA-676 | Supplier Device Package | 676-FCBGA (27x27) |
Number of I/O | 130 | Base Product Number | XC7Z035 |
Manufacturer | Xilinx | Product Category | SoC FPGA |
RoHS | Details | Mounting Style | SMD/SMT |
Core | ARM Cortex A9 | Number of Cores | 2 Core |
Maximum Clock Frequency | 667 MHz | L1 Cache Instruction Memory | 2 x 32 kB |
L1 Cache Data Memory | 2 x 32 kB | Number of Logic Elements | 275000 LE |
Adaptive Logic Modules - ALMs | 42975 ALM | Embedded Memory | 17.6 Mbit |
Number of I/Os | 250 I/O | Minimum Operating Temperature | 0 C |
Maximum Operating Temperature | + 85 C | Brand | Xilinx |
Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 21487.5 LAB |
Product Type | Processors - Application Specialized | Subcategory | SOC - Systems on a Chip |
Tradename | Zynq |
Warranty & Returns
Warranty, Returns, and Additional Information
-
QA & Return Policy ?
Parts Quality Guarantee: 365 days
Returns for refund: within 90 days
Returns for Exchange: within 90 days
-
Shipping and Package ?
Shipping:For example, FedEx, JP, UPS, DHL,SAGAWA, or YTC.
Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.
-
Payment ?
For example, channels like VISA,MasterCard,Western Union,PayPal,MoneyGram,Rakuten Pay and more.
If you have specific payment channel preferences or requirements, please get in touch with our sales team for assistance.

XC2C64A-7VQG44C
XILINX - XC2C64A-7VQG44C. - CPLD, COOLRUNNER-II, 64MCELL, 44VQFP

XC3042A-7PC84C
This product is a Programmable Logic IC that utilizes CMOS technology and features SMT for easy installation

XC5VFX130T-2FFG1738I
XC5VFX130T-2FFG1738I FPGA featuring 10240 Configurable Logic Blocks and 13172 logic cells

XC6VLX130T-2FFG784I
Get ready to elevate your development process with the XC6VLX130T-2FFG784I and unlock endless possibilities

XC3S200-4TQG144I
XC3S200-4TQG144I: FPGA with 200,000 system gates

XC5VLX50T-1FF1136C
FBGA-1136 technology used in XC5VLX50T-1FF1136C FPGA

XCS05-3PC84C
Plastic-encased FPGA with 100 CLBs, 2000 gates, and a frequency capability of 125MHz in LCC-84 configuration

MPC8313CVRAFFC
Processor speed: 333MHz

STM32L082KZT6
MCU 32-bit ARM Cortex M0+ RISC 192KB Flash 2.5V/3.3V 32-Pin LQFP Tray

10CL055YF484C8G
Field-Programmable Array

UPD70F3371M2GBA1-GAH-AX
Renesas Electronics 32BIT MCU V850ES/FE3

MC68HC000EI16
Microcontroller with ARM Cortex M3 core and 384KB Flash memory

MSP430F235TPMR
Cutting-edge 16-bit microcontroller designed for ultra-low power operation

XC7Z035-1FBG676C
Versatile and powerful chip
Inventory:
8,589
Warranty & Returns
After Sales Service
What after-sales service can be provided?
We provide an extended quality assurance period of 365 days for all components we offer. If a return or exchange becomes essential, kindly adhere to these guidelines:
·Initiate the request within 90 days after the item's shipment date.
·Coordinate the return or exchange with our team.
·Keep the items in their original condition as delivered.
·Please be aware that the feasibility of returning or exchanging items is contingent upon an evaluation of their actual state upon return.
Shipping
What channels of transportation of goods does the website support?
We usually send out our orders during business days using FedEx, SF, UPS, or DHL. We're also here to assist with alternative shipping options. Should you require additional information about shipping particulars or expenses, please don't hesitate to get in touch with us.







Package
How to ensure that the parts will be intact during transportation?
The items we ship will be packaged in anti-static bags, ensuring ESD anti-static protection, while the outer packaging boasts exceptional durability and sealing. We offer packaging options like Tape and Reel, Cut Tape, Tube, or Tray to suit your needs.




Payment
Which payment methods can be used to pay for goods
Accepted payment methods commonly encompass VISA, MasterCard, UnionPay, Western Union, PayPal, and various other options.
Should you have a particular payment preference or wish to seek information on rates and other specifics, please feel free to reach out to us.




