• XC7Z035-1FBG676C FCBGA-676
XC7Z035-1FBG676C FCBGA-676

XC7Z035-1FBG676C

Versatile and powerful chip

Inventory:8,589

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Overview of XC7Z035-1FBG676C

The XC7Z035-1FBG676C is a System-on-Chip (SoC) optimized for low-power, high-performance, and wide connectivity options. It provides excellent performance for various applications that require efficient processing and memory handling.

Pinout

The XC7Z035-1FBG676C pinout refers to the configuration and function of each pin in its FCBGA-676(27x27) package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the XC7Z035-1FBG676C has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • Lov-power: The XC7Z035-1FBG676C offers low power consumption for efficient operation in various applications.
  • 140 DSP slices: This SoC features 140 digital signal processing (DSP) slices for high-performance signal processing and analysis.
  • LPDDR2 interface: The XC7Z035-1FBG676C supports LPDDR2 memory interface for efficient data transfer and processing.
  • High-performance processor: This SoC includes a high-performance processor for efficient execution of complex algorithms and tasks.
  • 67,000 slices: The XC7Z035-1FBG676C has 67,000 logic elements (slices) for implementing various digital functions and interfaces.
  • Wide connectivity options: This SoC provides wide connectivity options including DDR3L support for diverse memory interfaces.

Applications

  • Sensors and controls: The XC7Z035-1FBG676C is suitable for sensors and control systems that require efficient data processing and analysis.
  • Wireless applications: This SoC can be used in various wireless applications such as GPS tracking, remote control systems, and wireless communication networks.
  • Power management: The XC7Z035-1FBG676C is suitable for power management systems that require efficient energy consumption and optimization.

Advantages and Disadvantages

Advantages

  • Low-power architecture: The XC7Z035-1FBG676C is designed for low power consumption, making it suitable for applications that require efficient energy utilization.
  • High-performance processing capabilities: This SoC features a high-performance processor for efficiently executing complex algorithms and tasks.
  • Suitable for diverse applications: The XC7Z035-1FBG676C is designed to support various applications, including sensors and controls, wireless communication systems, and power management systems.

Disadvantages

  • Complex programming requirements: Implementing the XC7Z035-1FBG676C requires advanced programming skills and knowledge of its architecture and interfaces.
  • Limited availability of compatible software tools: The development environment for the XC7Z035-1FBG676C may be limited, which can make it difficult to find compatible software tools and platforms.

Equivalents

For similar functionalities, consider these alternatives to the XC7Z035-1FBG676C:

  • Zynq-7000 SoC: This SoC is a low-power, high-performance alternative for various applications.
  • Arriia i.MX 8 series: These processors offer efficient processing and memory handling capabilities similar to the XC7Z035-1FBG676C.
  • Tegra X1 processor: This processor features advanced AI capabilities, suitable for applications that require intelligent image or data analysis.

Frequently Asked Questions

Q: What is the maximum processor frequency of the XC7Z035-1FBG676C?
A: The maximum processor frequency is specified as 1.2 GHz, but it can be adjusted depending on specific application requirements.

Q: Can I use the XC7Z035-1FBG676C for Linux-based applications?
A: Yes, this SoC supports various operating systems, including Linux, making it suitable for a wide range of applications.

Q: Are there any specific design considerations for using the XC7Z035-1FBG676C in power management applications?
A: Yes, when designing power management applications with this SoC, consider optimizing clock signals and configuring memory interfaces to minimize power consumption.

Q: Can I use the XC7Z035-1FBG676C for machine learning or AI-based applications?
A: Yes, this SoC features dedicated acceleration engines for matrix arithmetic operations, making it suitable for various machine learning and AI-related applications.

XC7Z035-1FBG676C

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series XC7Z035 Product Status Active
Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells Operating Temperature 0°C ~ 85°C (TJ)
Package / Case FCBGA-676 Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130 Base Product Number XC7Z035
Manufacturer Xilinx Product Category SoC FPGA
RoHS Details Mounting Style SMD/SMT
Core ARM Cortex A9 Number of Cores 2 Core
Maximum Clock Frequency 667 MHz L1 Cache Instruction Memory 2 x 32 kB
L1 Cache Data Memory 2 x 32 kB Number of Logic Elements 275000 LE
Adaptive Logic Modules - ALMs 42975 ALM Embedded Memory 17.6 Mbit
Number of I/Os 250 I/O Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C Brand Xilinx
Moisture Sensitive Yes Number of Logic Array Blocks - LABs 21487.5 LAB
Product Type Processors - Application Specialized Subcategory SOC - Systems on a Chip
Tradename Zynq

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XC7Z035-1FBG676C

Versatile and powerful chip

Inventory:

8,589