XC7A50T-L1FTG256I

Overview of XC7A50T-L1FTG256I Artix-7 FPGA

The Xilinx XC7A50T-L1FTG256I is a high-performance, cost-optimized FPGA from the renowned Artix-7 family, designed for applications demanding a balance of logic capacity, power efficiency, and connectivity. This high-efficiency programmable logic chip integrates 52,160 Logic Elements and 8,150 Adaptive Logic Modules (ALMs), providing substantial digital signal processing resources. With 2.64 Mbits of embedded memory (comprising 2,700 kbit Block RAM and 600 kbit distributed RAM) and 170 I/O pins, it offers excellent data buffering and system interface capabilities. Operating from a 1V core supply within an industrial temperature range of -40°C to +100°C, this durable FPGA is ideal for space-constrained, power-sensitive designs in industrial automation, motor control, and portable medical equipment. Its FBGA-256 package supports robust SMD/SMT assembly, making it a reliable core for embedded vision systems, software-defined radio, and automotive sensor fusion applications.

Manufacturer Information

Xilinx, now part of AMD, is a global leader in adaptive computing, pioneering the Field-Programmable Gate Array (FPGA) technology. The company's core expertise lies in delivering highly flexible and scalable all-programmable devices, including FPGAs, SoCs, and ACAPs, that accelerate innovation across data centers, automotive, aerospace, and industrial markets. Xilinx's product portfolios, such as the Artix-7 series to which this component belongs, are renowned for their performance-per-watt advantages and comprehensive development tool support, enabling designers to implement complex digital logic and signal processing algorithms efficiently.

Key Features

• Integrates 52,160 Logic Elements (8,150 ALMs) for high-density digital logic implementation.
• Provides 2.64 Mbits of total embedded memory for efficient data storage and buffering.
• Features 170 I/O pins supporting versatile interface standards and protocols.
• Operates on a low 1V core voltage for optimized power efficiency in portable designs.
• Rated for industrial-grade reliability across a -40°C to +100°C operating temperature range.
• Utilizes a compact FBGA-256 package suitable for space-constrained SMD/SMT applications.

Packaging Details

FBGA-256 (Fine-Pitch Ball Grid Array) package. This surface-mount package is designed for high-density PCB layouts and is fully compatible with standard SMT (Surface Mount Technology) assembly processes.

Equivalent / Alternative Parts

• XC7A50T-2FGG484I (Xilinx) - Higher I/O count (285 I/O) in a larger package for expanded connectivity.
• XC7A35T-1FGG484I (Xilinx) - Lower logic density alternative (33,280 LE) within the same Artix-7 family.
• 10M50DAF484C8G (Intel/Altera) - Functionally similar MAX 10 FPGA, offering non-volatile configuration.

Advantages

• Superior logic-to-power ratio within its class, enabled by the 28nm Artix-7 architecture and 1V operating voltage, making it ideal for battery-powered or thermally constrained systems.
• Combines a substantial amount of block and distributed RAM (2.64 Mbit total) with high logic density, offering greater design flexibility for data-path-intensive applications compared to FPGAs with less memory.
• The industrial temperature rating (-40°C to +100°C) provides a wider operational safety margin than commercial-grade parts, enhancing long-term reliability in harsh environments.

Lifecycle Status & Updates

Stable supply. For the most current product lifecycle status, product change notifications (PCN), or end-of-life (EOL) information, please consult the manufacturer's official product resources.

Application Examples

• Motor Control Drives (Industrial)
• Portable Medical Imaging Devices
• Automotive Camera Interface Modules
• Software-Defined Radio (SDR) Platforms
• Industrial IoT Gateway Logic
• Test & Measurement Equipment

Technical Specifications

• Product Category: FPGA - Field Programmable Gate Array
• Series: Xilinx Artix-7
• Logic Elements: 52,160 LE
• Embedded Memory: 2.64 Mbit
• I/O Count: 170 I/O
• Operating Voltage: 1 V
• Operating Temperature: -40°C to +100°C
• Package: FBGA-256

Pinout and Functionality

• Pin configuration is highly user-programmable. Specific functions for pins (e.g., Bank voltage, clock inputs, dedicated configuration pins, and general-purpose I/O) are defined by the designer using Xilinx Vivado tools. Refer to the official "Artix-7 FPGAs Packaging and Pinouts" user guide (UG475) for the complete pinout table and bank diagrams.

FAQ Section

Q: What is the core voltage?
A: 1V nominal (0.95V to 1.05V range).

Q: Is it suitable for industrial use?
A: Yes, rated for -40°C to +100°C operation.

Q: How much memory does it have?
A: 2.64 Mbits total embedded RAM.

Q: What package type is it?
A: FBGA-256, a surface-mount BGA.

Q: Number of user I/O pins?
A: 170 I/O pins available.

Q: Minimum operating temperature?
A: -40 degrees Celsius.

Q: Is it RoHS compliant?
A: See manufacturer details for current compliance status.