• XC6VLX130T-2FFG1156I FCBGA-1156
XC6VLX130T-2FFG1156I FCBGA-1156

XC6VLX130T-2FFG1156I

40nm Technology

Quantity Unit Price(USD) Ext. Price
1008 $2,849.094 $2,871,886.75
504 $2,898.608 $1,460,898.43
192 $2,998.819 $575,773.25
1 $7,515.712 $7,515.71

Inventory:7,259

*The price is for reference only.
  • 90-day after-sales guarantee
  • 365 Days Quality Guarantee
  • Genuine Product Guarantee
  • 7*24 hours service quarantee

Rapid Quote

Submit your quote request for XC6VLX130T-2FFG1156I using this form.You can also reach us via email at Email: [email protected], and we will respond within 12 hours.

Overview of XC6VLX130T-2FFG1156I

The XC6VLX130T-2FFG1156I is a high-performance FPGA chip from Xilinx optimized for high-speed operations and low-voltage power supply. It provides excellent performance for specific applications such as analog and digital signal switching.

Pinout

The XC6VLX130T-2FFG1156I pinout refers to the configuration and function of each pin in its FCBGA-1156(35x35) package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the XC6VLX130T-2FFG1156I has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • High-performance 65nm Virtex-6 FPGA: The XC6VLX130T-2FFG1156I features a high-performance 65nm Virtex-6 FPGA.
  • 130,000 logic cells and 622,080 CLB flip-flops: It has 130,000 logic cells and 622,080 CLB flip-flops, providing dense integration of digital functions.
  • Supports 6.6 Mbits of block RAM and 680 DSP slices: The XC6VLX130T-2FFG1156I supports 6.6 Mbits of block RAM and 680 DSP slices, enabling efficient processing of complex data streams.
  • 1156-pin FF1156 package: It is packaged in a 1156-pin FF1156 package for easy integration into a circuit board.
  • 2 speed grade: The XC6VLX130T-2FFG1156I is available in 2 speed grades, allowing designers to choose the optimal operating frequency and power dissipation.
  • Integrated PowerPC 440 processor: It features an integrated PowerPC 440 processor for improved processing and memory interfaces.
  • 8 RocketIO™ transceivers and 64 user I/Os: The XC6VLX130T-2FFG1156I has 8 RocketIO™ transceivers and 64 user I/Os, providing flexible connectivity options for different applications.

Applications

  • Telecommunications and networking equipment: The XC6VLX130T-2FFG1156I is suitable for telecommunications and networking equipment that requires high-speed processing and low-latency interfaces.
  • High-performance computing: It is also applicable in high-performance computing for applications such as image and audio processing, scientific simulations, and data analytics.
  • Embedded systems: The XC6VLX130T-2FFG1156I can be used in embedded systems for applications like automotive electronics, industrial control systems, and medical devices.
  • Medical imaging equipment: It is suitable for medical imaging equipment that requires high-speed processing of complex data streams and low-latency interfaces.
  • Aerospace and defense applications: The XC6VLX130T-2FFG1156I can be applied in aerospace and defense applications, such as radar systems, communication systems, and electronic warfare devices.
  • Industrial automation: It is also suitable for industrial automation equipment that requires high-speed processing of complex data streams, low-latency interfaces, and reliable operation in harsh environments.
  • Other applications: The XC6VLX130T-2FFG1156I's advanced features make it applicable to a variety of other applications like consumer electronics, automotive electronics, and smart grids.

Advantages and Disadvantages

XC6VLX130T-2FFG1156I

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series XC6VLX130T Product Status Active
Programmabe Not Verified Number of LABs/CLBs 10000
Number of Logic Elements/Cells 128000 Total RAM Bits 9732096
Number of I/O 600 Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ)
Package / Case FCBGA-1156 Supplier Device Package 1156-FCBGA (35x35)
Base Product Number XC6VLX130 Manufacturer Xilinx
Product Category FPGA - Field Programmable Gate Array RoHS Details
Number of Logic Elements 128000 LE Adaptive Logic Modules - ALMs 20000 ALM
Embedded Memory 9.28 Mbit Number of I/Os 600 I/O
Supply Voltage - Min 1 V Supply Voltage - Max 1 V
Minimum Operating Temperature - 40 C Maximum Operating Temperature + 100 C
Data Rate 6.6 Gb/s Number of Transceivers 20 Transceiver
Mounting Style SMD/SMT Brand Xilinx
Distributed RAM 1740 kbit Embedded Block RAM - EBR 9504 kbit
Maximum Operating Frequency 1.6 GHz Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 10000 LAB Operating Supply Voltage 1 V
Product Type FPGA - Field Programmable Gate Array Subcategory Programmable Logic ICs
Tradename Virtex

Warranty & Returns

Warranty, Returns, and Additional Information

  • QA & Return Policy ?

    Parts Quality Guarantee: 365 days

    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

  • Shipping and Package ?

    Shipping:For example, FedEx, JP, UPS, DHL,SAGAWA, or YTC.

    Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.

  • Payment ?

    For example, channels like VISA,MasterCard,Western Union,PayPal,MoneyGram,Rakuten Pay and more.

    If you have specific payment channel preferences or requirements, please get in touch with our sales team for assistance.