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XC3S400-4FT256I

XC3S400-4FT256I is a Field-Programmable Gate Array (FPGA) presented in a Fine-Pitch Thin Ball Grid Array (FTBGA) package with 256 pins

Quantity Unit Price(USD) Ext. Price
1000 $21.449 $21,449.00
500 $21.843 $10,921.50
200 $22.639 $4,527.80
1 $58.499 $58.50

Inventory:7,952

*The price is for reference only.
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Overview of XC3S400-4FT256I

The XC3S400-4FT256I is a member of the Spartan-3 FPGA family from Xilinx. It features a high-density, high-performance, and low-cost implementation of the FPGA technology, making it suitable for a wide range of applications. This FPGA offers abundant logic resources, on-chip RAM, and numerous I/O capabilities, providing a versatile platform for digital system design.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VCCINT: Internal core voltage supply
  • VCCAUX: Auxiliary voltage supply
  • GND: Ground
  • VCCO_XO: I/O bank voltage
  • IO[0:95]: I/O pins
  • INIT_B: Initialization signal
  • PROGRAM_B: Configuration program signal
  • Done: Configuration complete indicator
  • DONE: Pin that indicates the successful configuration of the device
  • PROG_B: Program control pin
  • MODE(0-2): Mode select pins
  • UD: Unused pin

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the XC3S400-4FT256I FPGA for a visual representation.

Key Features

  • High-Density FPGA: The XC3S400-4FT256I offers a large number of configurable logic blocks, making it suitable for complex digital designs.
  • Low-Cost Implementation: This FPGA provides cost-effective implementation of digital systems without compromising performance.
  • High-Performance: With abundant logic resources and high-speed I/O capabilities, the XC3S400-4FT256I delivers high performance for demanding applications.
  • On-Chip RAM: Integrated RAM blocks enhance data processing and storage capabilities within the FPGA.
  • Wide I/O Support: The FPGA features multiple I/O banks with support for a variety of voltage standards and interfaces.

Note: For detailed technical specifications, please refer to the XC3S400-4FT256I datasheet.

Application

  • Digital System Design: The XC3S400-4FT256I is ideal for implementing complex digital systems, including signal processing, control systems, and embedded computing.
  • Prototyping: Use this FPGA for rapid prototyping and development of custom digital logic designs.
  • Communication Systems: Suitable for use in communication systems, including network infrastructure and data communication applications.

Functionality

The XC3S400-4FT256I FPGA provides a versatile platform for digital system design, offering high performance, abundant resources, and flexible I/O capabilities for various applications.

Usage Guide

  • Power Supply: Connect the VCCINT, VCCAUX, and VCCO_XO pins to their respective power supplies within the specified voltage range.
  • Configuration: Ensure proper configuration and initialization signals are provided to initialize the FPGA for operation.
  • I/O Connections: Utilize the abundant I/O pins for interfacing with external components and devices as per the design requirements.

Frequently Asked Questions

Q: Can the XC3S400-4FT256I be used for real-time signal processing applications?
A: Yes, the high-performance and configurable nature of the XC3S400-4FT256I make it well-suited for real-time signal processing and data manipulation tasks.

Q: Is the XC3S400-4FT256I suitable for low-power applications?
A: While the XC3S400-4FT256I is optimized for performance, power optimization techniques can be employed to suit low-power application requirements.

Equivalent

For similar functionalities, consider these alternatives to the XC3S400-4FT256I:

  • XC3S200-4FTG256C: This member of the Xilinx Spartan-3 FPGA family offers similar features in a smaller capacity, suitable for less complex designs.
  • XC3S500E-4FTG256I: A higher capacity FPGA from Xilinx, providing increased resources for more demanding digital system designs.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category FPGA - Field Programmable Gate Array Series XC3S400
Number of Logic Elements 8064 LE Adaptive Logic Modules - ALMs 3584 ALM
Embedded Memory 288 kbit Number of I/Os 173 I/O
Supply Voltage - Min 1.14 V Supply Voltage - Max 1.26 V
Minimum Operating Temperature - 40 C Maximum Operating Temperature + 100 C
Mounting Style SMD/SMT Package / Case FBGA-256
Brand Xilinx Distributed RAM 56 kbit
Embedded Block RAM - EBR 288 kbit Maximum Operating Frequency 280 MHz
Moisture Sensitive Yes Number of Gates 400000
Operating Supply Voltage 1.2 V Product Type FPGA - Field Programmable Gate Array
Factory Pack Quantity 1 Subcategory Programmable Logic ICs
Tradename Spartan Unit Weight 1.753137 oz

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XC3S400-4FT256I

XC3S400-4FT256I is a Field-Programmable Gate Array (FPGA) presented in a Fine-Pitch Thin Ball Grid Array (FTBGA) package with 256 pins

Inventory:

7,952