• XC3S2000-4FGG676C FBGA-676
XC3S2000-4FGG676C FBGA-676

XC3S2000-4FGG676C

XC3S2000-4FGG676C - Advanced Programmable Logic Device with 676 Ball Grid Array Package

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Overview of XC3S2000-4FG676C

The XC3S2000-4FGG676C is a field-programmable gate array (FPGA) featuring 2 million system gates, ideal for high-density and high-performance applications.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VCCINT: Internal supply voltage
  • VCCAUX: Auxiliary supply voltage
  • GND: Ground
  • IOB: Input/output bank
  • IOI: General-purpose input/output
  • MGT: Multi-gigabit transceivers
  • CFG: Configuration
  • GCLK: Global clock
  • EMAC: Ethernet MAC
  • USB: Universal serial bus

Circuit Diagram

Include a circuit diagram illustrating the FPGA connections and utilization of the XC3S2000-4FGG676C device.

Key Features

  • High Density: Offers 2 million system gates for complex logic implementations.
  • High Performance: Designed for high-speed operation in demanding applications.
  • Low Power Consumption: Features low power usage for energy-efficient designs.
  • Configuration Flexibility: Supports versatile configuration options for diverse project requirements.
  • Embedded IP: Includes various embedded intellectual property cores for enhanced functionality.

Note: For detailed technical specifications, please refer to the XC3S2000-4FGG676C datasheet.

Application

  • Communications Systems: Suitable for integration into communication systems for signal processing and data handling.
  • Embedded Control: Ideal for embedded control applications requiring programmable logic.
  • Digital Signal Processing: Used in DSP applications for real-time processing and algorithm implementation.

Functionality

The XC3S2000-4FGG676C FPGA provides a highly flexible and programmable platform for implementing complex digital designs with high performance and reliability.

Usage Guide

  • Power Supply: Connect VCCINT and VCCAUX to the appropriate power sources as per the datasheet recommendations.
  • IO Connections: Utilize the IOB and IOI pins for input/output operations based on project requirements.
  • Configuration Setup: Follow the configuration guidelines to enable the desired functionality of the FPGA.

Frequently Asked Questions

Q: Can the XC3S2000-4FGG676C be reprogrammed multiple times?
A: Yes, the XC3S2000-4FGG676C is a field-programmable device that can be reconfigured multiple times as needed.

Q: Is the XC3S2000-4FGG676C suitable for high-speed data processing applications?
A: Absolutely, the XC3S2000-4FGG676C is designed for high performance and is well-suited for high-speed data processing tasks.

Equivalent

For similar functionalities, consider these alternatives to the XC3S2000-4FGG676C:

  • XC6SLX45-3FGG484C: A lower-density FPGA with similar performance characteristics from Xilinx.
  • Altera Cyclone V: An FPGA series offering comparable features and performance to the XC3S2000-4FGG676C.

XC3S2000-4FGG676C

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC3S2000 Number of Logic Elements 46080 LE
Number of I/Os 489 I/O Supply Voltage - Min 1.2 V
Supply Voltage - Max 1.2 V Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C Mounting Style SMD/SMT
Package / Case FBGA-676 Brand AMD / Xilinx
Distributed RAM 320 kbit Embedded Block RAM - EBR 720 kbit
Maximum Operating Frequency 280 MHz Moisture Sensitive Yes
Number of Gates 2000000 Operating Supply Voltage 1.2 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs Tradename Spartan
Unit Weight 0.647256 oz

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