• XC3S1000-4FGG676I 676-BGA
XC3S1000-4FGG676I 676-BGA

XC3S1000-4FGG676I

Programmable gate array

Quantity Unit Price(USD) Ext. Price
1 $257.487 $257.49
200 $99.645 $19,929.00
500 $96.142 $48,071.00
1000 $94.411 $94,411.00

Inventory:8,370

*The price is for reference only.
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Overview of XC3S1000-4FGG676I

The XC3S1000-4FGG676I is a Spartan-3 FPGA from Xilinx with 1 million system gates, 13,312 logic cells, and 36 I/O pads. It is designed for high-performance applications requiring programmable logic implementation.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VCCINT: Internal core voltage
  • VCCAUX: Auxiliary supply voltage
  • GND: Ground
  • TCK: Test clock input for JTAG
  • TMS: Test mode select input for JTAG
  • TDI: Test data input for JTAG
  • TDO: Test data output for JTAG
  • PROGRAM_B: Programming enable input
  • CCLK: Clock input for configuration
  • DONE: Completion output
  • INIT_B: Initialization input

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the XC3S1000-4FGG676I FPGA for a visual representation.

Key Features

  • 1 Million System Gates: The XC3S1000-4FGG676I provides a large number of system gates for complex digital designs.
  • High Performance: This FPGA offers high speed and performance capabilities suitable for demanding applications.
  • Advanced Logic Cells: With 13,312 logic cells, it allows for intricate programmable logic configurations.
  • 36 I/O Pads: The FPGA features 36 I/O pads for interfacing with external devices and components.
  • Flexible Configuration: Programmable nature enables reconfiguration for different functions as needed.

Note: For detailed technical specifications, please refer to the XC3S1000-4FGG676I datasheet.

Application

  • Digital Signal Processing: Ideal for DSP applications requiring flexible and high-performance logic implementation.
  • Embedded Systems: Suitable for use in embedded systems where programmable logic adds customization options.
  • Communications Systems: Used in communications systems for protocol handling and data processing tasks.

Functionality

The XC3S1000-4FGG676I FPGA offers programmable logic functionality with a large number of system gates and logic cells. It enables users to implement custom digital circuits tailored to their specific applications.

Usage Guide

  • Power Supply: Connect VCCINT and VCCAUX to their respective power supplies for core and auxiliary voltage.
  • Configuration: Apply configuration signals such as PROGRAM_B, INIT_B, and CCLK for programming and initialization.
  • Input/Output: Utilize the I/O pads for external interfacing with other components and devices.

Frequently Asked Questions

Q: Can the XC3S1000-4FGG676I be used for real-time signal processing applications?
A: Yes, the XC3S1000-4FGG676I is capable of handling real-time signal processing tasks with its high-performance logic cells and system gates.

Equivalent

For similar functionalities, consider these alternatives to the XC3S1000-4FGG676I:

  • XC3S500E-4FTG256I: A smaller Spartan-3 FPGA with 500,000 system gates and 9,408 logic cells.
  • XC3S200-4FTG256I: This Spartan-3 FPGA offers a balance between logic capacity and I/O configuration for medium-scale designs.

XC3S1000-4FGG676I

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series XC3S1000 Product Status Active
Programmabe Not Verified Number of LABs/CLBs 1920
Number of Logic Elements/Cells 17280 Total RAM Bits 442368
Number of I/O 391 Number of Gates 1000000
Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) Package / Case FBGA-676
Supplier Device Package 676-FBGA (27x27) Base Product Number XC3S1000
Manufacturer Xilinx Product Category FPGA - Field Programmable Gate Array
RoHS Details Number of Logic Elements 17280 LE
Number of I/Os 391 I/O Supply Voltage - Min 1.2 V
Supply Voltage - Max 1.2 V Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 100 C Mounting Style SMD/SMT
Brand Xilinx Distributed RAM 120 kbit
Embedded Block RAM - EBR 432 kbit Maximum Operating Frequency 280 MHz
Moisture Sensitive Yes Operating Supply Voltage 1.2 V
Product Type FPGA - Field Programmable Gate Array Subcategory Programmable Logic ICs
Tradename Spartan Unit Weight 1.295128 oz

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