• XC3S1000-4FGG676I FBGA-676
XC3S1000-4FGG676I FBGA-676

XC3S1000-4FGG676I

Programmable gate array

Quantity Unit Price(USD) Ext. Price
1000 $56.073 $56,073.00
500 $57.101 $28,550.50
200 $59.180 $11,836.00
1 $152.925 $152.92

Inventory:8,370

*The price is for reference only.
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Overview of XC3S1000-4FGG676I

The XC3S1000-4FGG676I is a high-performance FPGA optimized for high-speed and low-voltage operations. It provides excellent performance for digital signal processing, embedded systems, and other applications that require fast switching times and low power consumption.

Pinout

The XC3S1000-4FGG676I pinout refers to the configuration and function of each pin in its 676-pin FBGA package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the XC3S1000-4FGG676I has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by XILINX to get accurate information regarding each pin's function and electrical characteristics.

Features

  • High-performance FPGA with 1 million system gates: The XC3S1000-4FGG676I is a high-performance FPGA that offers excellent performance for digital signal processing, embedded systems, and other applications that require fast switching times and low power consumption.
  • Supports up to 702 user I/O pins: The XC3S1000-4FGG676I has a total of 702 user I/O pins, making it suitable for complex digital signal processing and embedded systems applications.
  • 4.2 ns clock-to-out performance: The XC3S1000-4FGG676I offers excellent clock-to-out performance with a maximum clock frequency of 630 MHz and a minimum clock-to-out delay of 4.2 ns, making it suitable for high-speed digital signal processing applications.
  • Internal RAM capacity of 18 KB: The XC3S1000-4FGG676I has an internal RAM capacity of 18 KB, which is sufficient for most embedded systems and digital signal processing applications.
  • Advanced 90nm process technology: The XC3S1000-4FGG676I is manufactured using advanced 90nm process technology, which provides excellent performance, power consumption, and reliability.

Applications

  • Communications systems: The XC3S1000-4FGG676I is suitable for communications systems such as wireless communication systems, network routers, and switches.
  • Automotive electronics: The XC3S1000-4FGG676I is suitable for automotive electronics applications such as infotainment systems, driver assistance systems, and autonomous vehicles.
  • Industrial control systems: The XC3S1000-4FGG676I is suitable for industrial control systems such as process control systems, motor control systems, and automation systems.
  • Security systems: The XC3S1000-4FGG676I is suitable for security systems such as intrusion detection systems, access control systems, and surveillance systems.
  • Medical devices: The XC3S1000-4FGG676I is suitable for medical devices such as patient monitoring systems, imaging equipment, and medical implants.

Advantages and Disadvantages

The XC3S1000-4FGG676I has several advantages that make it an excellent choice for many applications. These include:

  • High-performance FPGA with 1 million system gates: The XC3S1000-4FGG676I offers excellent performance for digital signal processing, embedded systems, and other applications that require fast switching times and low power consumption.
  • Supports up to 702 user I/O pins: The XC3S1000-4FGG676I has a total of 702 user I/O pins, making it suitable for complex digital signal processing and embedded systems applications.
  • 4.2 ns clock-to-out performance: The XC3S1000-4FGG676I offers excellent clock-to-out performance with a maximum clock frequency of 630 MHz and a minimum clock-to-out delay of 4.2 ns, making it suitable for high-speed digital signal processing applications.
  • Internal RAM capacity of 18 KB: The XC3S1000-4FGG676I has an internal RAM capacity of 18 KB, which is sufficient for most embedded systems and digital signal processing applications.
  • Advanced 90nm process technology: The XC3S1000-4FGG676I is manufactured using advanced 90nm process technology, which provides excellent performance, power consumption, and reliability.

Frequently Asked Questions

Q: What is the maximum clock frequency of the XC3S1000-4FGG676I?
A: The maximum clock frequency of the XC3S1000-4FGG676I is 630 MHz.

Q: What is the minimum clock-to-out delay of the XC3S1000-4FGG676I?
A: The minimum clock-to-out delay of the XC3S1000-4FGG676I is 4.2 ns.

Q: How many user I/O pins does the XC3S1000-4FGG676I have?
A: The XC3S1000-4FGG676I has a total of 702 user I/O pins.

Q: What is the internal RAM capacity of the XC3S1000-4FGG676I?
A: The internal RAM capacity of the XC3S1000-4FGG676I is 18 KB.

Equivalents

The XC3S1000-4FGG676I has several equivalents that offer similar performance and features. These include:

  • XC3S200-5TQ144C: The XC3S200-5TQ144C is a high-performance FPGA that offers excellent performance for digital signal processing, embedded systems, and other applications that require fast switching times and low power consumption.
  • XC3S400-4FGG256I: The XC3S400-4FGG256I is a high-performance FPGA that offers excellent performance for digital signal processing, embedded systems, and other applications that require fast switching times and low power consumption.
  • XC3S800-5TQ144C: The XC3S800-5TQ144C is a high-performance FPGA that offers excellent performance for digital signal processing, embedded systems, and other applications that require fast switching times and low power consumption.

Frequently Asked Questions

Q: What are the equivalents of the XC3S1000-4FGG676I?
A: The equivalents of the XC3S1000-4FGG676I include the XC3S200-5TQ144C, XC3S400-4FGG256I, and XC3S800-5TQ144C.

XC3S1000-4FGG676I

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series XC3S1000 Product Status Active
Programmabe Not Verified Number of LABs/CLBs 1920
Number of Logic Elements/Cells 17280 Total RAM Bits 442368
Number of I/O 391 Number of Gates 1000000
Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) Package / Case FBGA-676
Supplier Device Package 676-FBGA (27x27) Base Product Number XC3S1000
Manufacturer Xilinx Product Category FPGA - Field Programmable Gate Array
RoHS Details Number of Logic Elements 17280 LE
Number of I/Os 391 I/O Supply Voltage - Min 1.2 V
Supply Voltage - Max 1.2 V Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 100 C Mounting Style SMD/SMT
Brand Xilinx Distributed RAM 120 kbit
Embedded Block RAM - EBR 432 kbit Maximum Operating Frequency 280 MHz
Moisture Sensitive Yes Operating Supply Voltage 1.2 V
Product Type FPGA - Field Programmable Gate Array Subcategory Programmable Logic ICs
Tradename Spartan Unit Weight 1.295128 oz

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