SMF130A

The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. SMF package is 50% smaller in footprint when compare to SMA package and deliverying one of the low height profiles (1.1mm) in the industry.

Key Features

• :
• 200W peak pulsepower capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01%
• Compatible with industrial standard package SOD-123FL
• Low profile: maximum height of 1.1mm.
• Low inductance, excellent clamping capability
• For surface mounted applications to optimize board space
• High temperature to reflow soldering guaranteed: 260°C/430sec
• Typical failure mode is short from over-specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
• ESD protection of data lines in accordance with IEC 61000-4-2
• EFT protection of data lines in accordance with IEC 61000-4-4
• Fast response time: typically less than 1.0ns from 0 Volts to VBR min
• Glass passivated junction
• Built-in strain relief
• Plastic package is flammability rated V-0 per Underwriters Laboratories
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead–free plated
• Halogen-free and RoHS compliant
• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD609A.01)
• UL Recognized to UL 497B

Application

• :
• SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications.