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NT5CC256M8JQ-EK

Low voltage operation at 1.35V

Inventory:6,136

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Overview of NT5CC256M8JQ-EK

The NT5CC256M8JQ-EK is a 256Mb DDR3L SDRAM module designed for use in memory applications. This module features high-speed data transfer rates and low operating voltage, making it suitable for various computing and embedded systems.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • A0-A13: Address Inputs
  • DQ0-DQ63: Data Inputs/Outputs
  • BA0, BA1: Bank Address Inputs
  • CK, CK#: Clock Inputs
  • CS#: Chip Select Input
  • DM, DM#: Data Mask Inputs
  • DQS, DQS#: Data Strobe Outputs
  • RAS, CAS, WE: Command Inputs
  • VDD, VSS: Power Supply and Ground

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the NT5CC256M8JQ-EK SDRAM module for a visual representation.

Key Features

  • 256Mb DDR3L SDRAM: Offers 256Mb of memory capacity with DDR3L low-power operation.
  • High-Speed Data Transfer: Supports high-speed data transfer rates for efficient memory performance.
  • Low Operating Voltage: Operates at low voltage levels, reducing power consumption in devices.
  • Bank Addressing: Features bank address inputs for memory bank selection and organization.
  • Data Mask Inputs: Includes data mask inputs for data protection and integrity.
  • Data Strobe Outputs: Provides data strobe outputs for synchronized data transfer.

Note: For detailed technical specifications, please refer to the NT5CC256M8JQ-EK datasheet.

Application

  • Computing Systems: Ideal for use in computing systems requiring high-speed and efficient memory.
  • Embedded Devices: Suitable for embedded devices and IoT applications where low-power memory is essential.
  • Networking Equipment: Used in networking equipment for data storage and processing requirements.

Functionality

The NT5CC256M8JQ-EK DDR3L SDRAM module provides reliable memory storage and retrieval capabilities for a wide range of applications, ensuring smooth operation and data handling.

Usage Guide

  • Power Supply: Connect the VDD and VSS pins to the appropriate power supply levels.
  • Data Connections: Interface the data input and output pins (DQ0-DQ63) for data transfer.
  • Clock Setup: Provide clock signals to the CK and CK# pins for synchronous operation.

Frequently Asked Questions

Q: What is the operating voltage range of the NT5CC256M8JQ-EK module?
A: The NT5CC256M8JQ-EK operates at a low voltage range typically around 1.35V, offering power efficiency.

Q: Can the NT5CC256M8JQ-EK module be used in mobile devices?
A: Yes, the low-power characteristics and high-speed performance make the NT5CC256M8JQ-EK suitable for mobile and battery-operated devices.

Equivalent

For similar memory solutions, consider these alternatives to the NT5CC256M8JQ-EK:

  • MT47H128M8HQ-25E: A 128Mb DDR3 SDRAM module with similar performance and compatibility features.
  • IS43TR16640A-125KBLI: This 1Gb DDR3L SDRAM offers higher memory capacity while maintaining low-power operation.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) EAR99 Part Status Active
HTS 8542.32.00.36 Automotive No
PPAP No DRAM Type DDR3L SDRAM
Chip Density (bit) 2G Organization 256Mx8
Number of Internal Banks 8 Number of Words per Bank 32M
Number of Bits/Word (bit) 8 Data Bus Width (bit) 8
Maximum Clock Rate (MHz) 1866 Maximum Access Time (ns) 0.195
Address Bus Width (bit) 18 Interface Type SSTL_135
Minimum Operating Supply Voltage (V) 1.283 Typical Operating Supply Voltage (V) 1.35
Maximum Operating Supply Voltage (V) 1.45 Operating Current (mA) 75
Minimum Operating Temperature (°C) 0 Maximum Operating Temperature (°C) 95
Supplier Temperature Grade Commercial Number of I/O Lines (bit) 8
Packaging Tape and Reel Mounting Surface Mount
Package Height 1(Max) Package Width 7.5
Package Length 10.5 PCB changed 78
Standard Package Name BGA Supplier Package TFBGA
Pin Count 78 Lead Shape Ball

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