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NT5CC256M8IN-DI

High Density 1.35V DRAM Chip

Inventory:9,755

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Overview of NT5CC256M8IN-DI

The NT5CC256M8IN-DI is a 256Mb DDR3 SDRAM memory module designed for high-speed data storage and retrieval applications. It offers a high data transfer rate and low power consumption, making it suitable for various computing and embedded systems.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VDD: Power Supply
  • CKE: Clock Enable
  • A0-A13: Address Inputs
  • DQ0-DQ63: Data Inputs/Outputs
  • CS: Chip Select
  • WE: Write Enable
  • RAS: Row Address Strobe
  • CAS: Column Address Strobe
  • DM: Data Mask
  • RD: Read Enable
  • CLK: Clock Input
  • BA0-BA2: Bank Address Inputs
  • DQS/DQSN: Data Strobe/Inverted Data Strobe
  • DM: Data Mask

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the NT5CC256M8IN-DI memory module for a visual representation.

Key Features

  • High-Speed Data Transfer: Supports high data transfer rates, suitable for demanding applications.
  • Low Power Consumption: Operates with low power requirements, ideal for energy-efficient systems.
  • Large Capacity: Offers 256Mb of storage capacity for storing a significant amount of data.
  • Wide Compatibility: Compatible with various computing and embedded systems that require DDR3 SDRAM.
  • Reliable Performance: Provides reliable performance for data storage and retrieval tasks.

Note: For detailed technical specifications, please refer to the NT5CC256M8IN-DI datasheet.

Application

  • Computer Systems: Suitable for use in desktops, laptops, servers, and other computing devices.
  • Embedded Systems: Ideal for embedded applications requiring high-speed memory access.
  • Networking Equipment: Used in networking devices for data buffering and processing.

Functionality

The NT5CC256M8IN-DI DDR3 SDRAM memory module provides fast and efficient data storage and retrieval capabilities, catering to the needs of computing and embedded systems.

Usage Guide

  • Power Supply: Connect VDD (Pin 1) to the power supply voltage.
  • Data Connections: Utilize the address inputs (A0-A13) and data inputs/outputs (DQ0-DQ63) for data transfer.
  • Control Signals: Configure the control inputs (CS, WE, RAS, CAS, DM, RD, CLK, BA0-BA2, DQS/DQSN) for memory operation.

Frequently Asked Questions

Q: What is the operating voltage range of the NT5CC256M8IN-DI?
A: The NT5CC256M8IN-DI operates within a voltage range specified in the datasheet, typically around 1.35V to 1.5V.

Q: Is the NT5CC256M8IN-DI compatible with DDR2 systems?
A: No, the NT5CC256M8IN-DI is designed for DDR3 SDRAM systems and may not be compatible with DDR2 interfaces.

Equivalent

For similar functionalities, consider these alternatives to the NT5CC256M8IN-DI:

  • MT47H128M8CF-25E:A 128Mb DDR3 SDRAM module suitable for high-speed memory applications.
  • W9751G6KB25:A DDR3 SDRAM memory chip with comparable features and performance to the NT5CC256M8IN-DI.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) EAR99 Part Status Obsolete
HTS 8542.32.00.36 Automotive No
PPAP No DRAM Type DDR3L SDRAM
Chip Density (bit) 2G Organization 256Mx8
Number of Internal Banks 8 Number of Words per Bank 32M
Number of Bits/Word (bit) 8 Data Bus Width (bit) 8
Maximum Clock Rate (MHz) 800 Maximum Access Time (ns) 0.4
Address Bus Width (bit) 18 Interface Type SSTL_135
Minimum Operating Supply Voltage (V) 1.283 Maximum Operating Supply Voltage (V) 1.45
Operating Current (mA) 210 Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95 Supplier Temperature Grade Extended Commercial
Number of I/O Lines (bit) 8 Mounting Surface Mount
Package Height 0.8(Max) Package Width 8
Package Length 10.5 PCB changed 78
Standard Package Name BGA Supplier Package VFBGA
Pin Count 78

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Warranty, Returns, and Additional Information

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NT5CC256M8IN-DI

High Density 1.35V DRAM Chip

Inventory:

9,755