• NT5CB128M16FP-DII TFBGA-96
NT5CB128M16FP-DII TFBGA-96

NT5CB128M16FP-DII

2Gbit DDR3 SDRAM

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Overview of NT5CB128M16FP-DII

The NT5CB128M16FP-DII is a high-speed CMOS 128M bit synchronous DRAM organized as 8,388,608 words x 16 bits x 4 banks.This memory module offers fast data transfer rates and high capacity, making it suitable for a variety of computing and storage applications.

Pinout

(Note:The pin configuration below is a general representation.Refer to the specific datasheet for precise details.)

  • VDD:Power Supply Voltage
  • VSS:Ground
  • DQ:Data Input/Output Pins
  • CLK:Clock Input
  • CS:Chip Select
  • WE:Write Enable
  • RAS:Row Address Strobe
  • CAS:Column Address Strobe
  • BA0-BA1:Bank Address Inputs
  • DM:Data Mask for Write

Circuit Diagram

Include a detailed circuit diagram illustrating the connections and operation of the NT5CB128M16FP-DII for a better understanding of its functionality.

Key Features

  • High-Speed Operation:The NT5CB128M16FP-DII offers fast data transfer rates, ideal for demanding computing tasks and real-time applications.
  • Large Capacity:With a storage capacity of 128M bits, this synchronous DRAM module can handle substantial amounts of data efficiently.
  • Low Power Consumption:Designed with low-power CMOS technology, the NT5CB128M16FP-DII helps conserve energy in electronic systems.
  • Multiple Banks:Featuring 4 banks, this memory module supports concurrent access to different memory locations, enhancing performance.
  • Wide Operating Voltage Range:Operates within a wide voltage range, providing flexibility in diverse system configurations.

Note:For detailed technical specifications, please refer to the NT5CB128M16FP-DII datasheet.

Application

  • Computer Systems:Integrated into computer systems for main memory storage and data processing tasks.
  • Networking Equipment:Utilized in networking devices for buffer memory and packet processing applications.
  • Embedded Systems:Incorporated into embedded systems for reliable and high-speed data storage capabilities.

Functionality

The NT5CB128M16FP-DII is a high-speed synchronous DRAM that provides efficient data storage and retrieval functions for various electronic devices and systems.

Usage Guide

  • Power Supply:Connect VDD(Pin X) and VSS(Pin Y) to the appropriate power and ground sources.
  • Data Transfer:Use the DQ pins for bidirectional data transfer between the memory module and the controller.
  • Timing Control:Manage timing signals such as CLK, CS, WE, RAS, and CAS for synchronized operation.

Frequently Asked Questions

Q:What is the maximum clock frequency supported by the NT5CB128M16FP-DII?
A:The NT5CB128M16FP-DII can support clock frequencies up to X MHz for high-speed data processing.

Q:Does the NT5CB128M16FP-DII support ECC (Error-Correcting Code) functionality?
A:Yes, the NT5CB128M16FP-DII is designed to support ECC for enhanced data integrity and error detection/correction capabilities.

Equivalent

For similar functionality and performance, consider exploring these alternatives to the NT5CB128M16FP-DII:

  • NT5CB128M16HP-DII:A high-performance version of the NT5CB128M16FP-DII with enhanced speed and features.
  • NT5CB256M16FP-DII:An upgraded variant offering higher memory capacity while maintaining similar operational characteristics.

NT5CB128M16FP-DII

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) EAR99 Part Status Obsolete
HTS 8542.32.00.36 DRAM Type DDR3 SDRAM
Chip Density (bit) 2G Organization 128Mx16
Number of Internal Banks 8 Number of Words per Bank 16M
Number of Bits/Word (bit) 16 Data Bus Width (bit) 16
Maximum Clock Rate (MHz) 1600 Maximum Access Time (ns) 0.225
Address Bus Width (bit) 17 Interface Type SSTL_15
Minimum Operating Supply Voltage (V) 1.425 Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 160 Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 95 Supplier Temperature Grade Industrial
Number of I/O Lines (bit) 16 Mounting Surface Mount
Package Height 0.8(Max) Package Width 9
Package Length 13 PCB changed 96
Standard Package Name BGA Supplier Package TFBGA
Pin Count 96 Lead Shape Ball

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