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MX30LF4G28AD-TI

Compact 48-pin TSOP-I package for easy integration

Quantity Unit Price(USD) Ext. Price
960 $1.706 $1,637.76
500 $1.751 $875.50
100 $1.848 $184.80
30 $2.062 $61.86
10 $2.274 $22.74
1 $2.629 $2.63

Inventory:6,521

*The price is for reference only.
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Overview of MX30LF4G28AD-TI

The MX30LF4G28AD-TI is a 4Gb (512M x 8/256M x 16) multi-level cell (MLC) NAND flash memory IC designed for high-density storage applications. It offers a cost-effective solution for data storage and retrieval in various electronic devices and systems.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • ALE: Address Latch Enable
  • CLE: Command Latch Enable
  • CE: Chip Enable
  • WE: Write Enable
  • R/B: Ready/Busy Status
  • RE: Read Enable
  • WP: Write Protect
  • VCC: Power Supply
  • GND: Ground

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the MX30LF4G28AD-TI for a visual representation.

Key Features

  • High Density: The MX30LF4G28AD-TI offers 4Gb of storage capacity, making it suitable for high-density data storage applications.
  • Multi-Level Cell (MLC) Technology: This NAND flash memory utilizes MLC technology to store multiple bits per cell, increasing storage efficiency.
  • Fast Data Transfer: With high-speed interface options, the MX30LF4G28AD-TI enables fast data transfer for efficient read and write operations.
  • Cost-Effective: The MLC design and high storage density provide a cost-effective solution for mass storage applications.

Note: For detailed technical specifications, please refer to the MX30LF4G28AD-TI datasheet.

Application

  • Mass Storage Devices: Ideal for use in mass storage devices such as USB drives, SD cards, and solid-state drives (SSDs).
  • Embedded Systems: Suitable for embedded systems requiring high-density non-volatile memory for program and data storage.
  • Consumer Electronics: Used in various consumer electronic devices such as digital cameras, media players, and smart TVs for data storage.

Functionality

The MX30LF4G28AD-TI is a high-density NAND flash memory IC that provides efficient and reliable data storage and retrieval capabilities for electronic devices and systems.

Usage Guide

  • Power Supply: Connect VCC (Pin) and GND (Pin) to the appropriate power and ground sources.
  • Data Transfer: Control the CE, WE, and other relevant pins to manage data read and write operations.
  • Status Monitoring: Utilize R/B and other status pins to monitor device readiness and operation status.

Frequently Asked Questions

Q: What is the maximum data transfer speed supported by the MX30LF4G28AD-TI?
A: The MX30LF4G28AD-TI supports high-speed data transfer, with specific speeds detailed in the datasheet for different interface options.

Q: Is the MX30LF4G28AD-TI compatible with USB 3.0 interface?
A: Yes, the MX30LF4G28AD-TI can be configured to work with USB 3.0 interface for high-speed data transfer in compatible applications.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) 3A991b.1.a. Part Status Active
HTS 8542.32.00.71 Automotive No
PPAP No Cell Type SLC NAND
Chip Density (bit) 4G Architecture Sectored
Boot Block No Block Organization Symmetrical
Address Bus Width (bit) 30 Sector Size 256Kbyte x 2048
Page Size 4Kbyte Number of Bits/Word (bit) 8
Number of Words 512M Programmability Yes
Timing Type Synchronous Max. Access Time (ns) 25
Maximum Erase Time (s) 0.006/Block Maximum Programming Time (ms) 0.7/Page
Interface Type Parallel Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3 Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6 Operating Current (mA) 30
Program Current (mA) 30 Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85 Supplier Temperature Grade Industrial
Command Compatible Yes ECC Support Yes
Support of Page Mode Yes Minimum Endurance (Cycles) 60000(Typ)
Mounting Surface Mount Package Height 1
Package Width 18.4 Package Length 12
PCB changed 48 Standard Package Name SO
Supplier Package TSOP-I Pin Count 48

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Warranty, Returns, and Additional Information

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    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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packageimg

MX30LF4G28AD-TI

Compact 48-pin TSOP-I package for easy integration

Inventory:

6,521