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IS43DR16160A-5BBLI

Low-voltage 84-pin BGA package

Inventory:5,330

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Overview of IS43DR16160A-5BBLI

The IS43DR16160A-5BBLI is a DRAM optimized for high-speed and low-power operations. It provides excellent performance for networking equipment, servers, automotive applications, industrial control systems, and consumer electronics such as smartphones and tablets.

Pinout

The IS43DR16160A-5BBLI pinout refers to the configuration and function of each pin in its BGA-84 package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the IS43DR16160A-5BBLI has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • High-speed performance: Provides fast data processing and efficient memory storage
  • Compact BGA package: Offers space-saving design with low power consumption
  • Low power consumption: Enables energy-efficient operation for various applications
  • Suitable for DDR2 SDRAM applications: Supports smooth memory access and advanced data transfer capabilities
  • Robust construction: Ensures durable packaging and reliable component design

Applications

  • Networking equipment, servers, and automotive applications: Suitable for high-performance computing and storage requirements in these industries
  • Industrial control systems and consumer electronics such as smartphones and tablets: Enables efficient data processing and memory storage capabilities in various devices and applications

Advantages and Disadvantages

Advantages

  • Fast data processing: Enables quick data transfer between memory components
  • Energy-efficient operation: Low power consumption reduces heat generation and prolongs component lifespan

Disadvantages

  • May require specialized knowledge for installation and configuration: Components of this type may be more challenging to integrate into certain projects due to their specific technical requirements.
  • Higher cost compared to other memory solutions: The advanced capabilities and features of the IS43DR16160A-5BBLI make it a more expensive option relative to standard DRAMs or other memory technologies.

Equivalents

For similar functionalities, consider these alternatives to the IS43DR16160A-5BBLI:

  • BST DDR2 SDRAM: Provides high-performance computing and storage capabilities for various applications
  • Nanya DDR2 SDRAM: Offers energy-efficient operation, fast data processing, and robust construction, similar to the IS43DR16160A-5BBLI

Frequently Asked Questions

Q: How does the IS43DR16160A-5BBLI support high-speed data transfer?
A: It achieves this through its high-frequency clock signal processing and advanced memory access control capabilities.

Q: Can I use the IS43DR16160A-5BBLI in my server's networking equipment?
A: Yes, it is suitable for high-performance computing applications such as servers and networking equipment that require fast data transfer and efficient memory storage.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Obsolete Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Part Package Code BGA Package Description TFBGA, BGA84,9X15,32
Pin Count 84 Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST Access Time-Max 0.6 ns
Additional Feature AUTO/SELF REFRESH Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B84 JESD-609 Code e1
Length 12.5 mm Memory Density 268435456 bit
Memory IC Type DDR2 DRAM Memory Width 16
Number of Functions 1 Number of Ports 1
Number of Terminals 84 Number of Words 16777216 words
Number of Words Code 16000000 Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
Organization 16MX16 Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY Package Code TFBGA
Package Equivalence Code BGA84,9X15,32 Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Power Supplies 1.8 V
Qualification Status Not Qualified Refresh Cycles 8192
Seated Height-Max 1.2 mm Self Refresh YES
Sequential Burst Length 4,8 Standby Current-Max 0.005 A
Supply Current-Max 0.21 mA Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES Technology CMOS
Temperature Grade INDUSTRIAL Terminal Finish TIN SILVER COPPER
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Width 8 mm
Package Tray Product Status Obsolete
Programmabe Not Verified Memory Type Volatile
Memory Format DRAM Memory Size 256Mbit
Memory Organization 16M x 16 Memory Interface Parallel
Clock Frequency 200 MHz Write Cycle Time - Word, Page 15ns
Access Time 600 ps Voltage - Supply 1.7V ~ 1.9V
Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount
Package / Case 84-TFBGA Supplier Device Package 84-TWBGA (8x12.5)
Base Product Number IS43DR16160

Warranty & Returns

Warranty, Returns, and Additional Information

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    Parts Quality Guarantee: 365 days

    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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IS43DR16160A-5BBLI

Low-voltage 84-pin BGA package

Inventory:

5,330