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Bluetooth Class 1.5 4Mbps 76-Pin VQFN EP T/R

Quantity Unit Price(USD) Ext. Price
1 $4.901 $4.90
250 $1.896 $474.00
500 $1.830 $915.00
1000 $1.798 $1,798.00


*The price is for reference only.
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Quick Inquiry

Please submit RFQ for CC2560ARVMT or email to us: Email: [email protected], we will contact you in 12 hours.

Overview of CC2560ARVMT

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

Key Features

  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules


The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Status Not For New Designs Programmabe Not Verified
Type Bluetooth RF Family/Standard Bluetooth
Protocol Bluetooth v4.0 Modulation GFSK, GMSK
Frequency 2.4GHz Data Rate (Max) 4Mbps
Power - Output 12dBm Sensitivity - 95 dBm
Serial Interfaces I²S, UART Voltage - Supply 2.2V ~ 4.8V
Current - Receiving 40.5mA ~ 41.2mA Current - Transmitting 40.5mA ~ 41.2mA
Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount
Package / Case VQFNP-76 Supplier Device Package 76-VQFNP-MR (8x8)
Base Product Number CC2560 Manufacturer Texas Instruments
Product Category RF Transceiver RoHS Details
Frequency Range 2.4 GHz Maximum Data Rate 3 Mbps
Modulation Format EDR, GFSK Supply Voltage - Min 2.2 V
Supply Voltage - Max 4.8 V Output Power 12 dBm
Minimum Operating Temperature - 40 C Maximum Operating Temperature + 85 C
Interface Type HCI, PCM, UART Brand Texas Instruments
Development Kit MSP-WDS430BT1000AD Maximum Operating Frequency 26 MHz
Moisture Sensitive Yes Mounting Style SMD/SMT
Operating Temperature Range - 40 C to + 85 C Product Type RF Transceiver
Series CC2560 Factory Pack Quantity 250
Subcategory Wireless & RF Integrated Circuits Technology Si

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    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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