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BM70BLES1FC2-0B04AA

BLE 3V 33-Pin Module

Inventory:7,917

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Overview of BM70BLES1FC2-0B04AA

BM70BLES1FC2-0B04AA is a Bluetooth module optimized for high-speed and low-voltage operations, providing excellent performance for various applications such as industrial automation, healthcare devices, asset tracking, IoT devices, wearable tech, home automation, energy management, automotive solutions, and sensor networks.

Pinout

The BM70BLES1FC2-0B04AA pinout refers to the configuration and function of each pin in its SMD-33P package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the BM70BLES1FC2-0B04AA has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • Bluetooth 5 Certified: Ensures compatibility with various devices and applications.
  • Module certified for use in USA, Canada, Europe, Japan, Korea, Taiwan, and China: Provides global compatibility.
  • Mobile Application supported in Microchip Bluetooth Data (MBD): Enables seamless integration with various mobile devices.
  • Latest Firmware Revision: 2.03 (BM70BLEx1FC2-0B05BA): Ensures the latest features and improvements.
  • Supports LE Secure Connections levels 1-3: Provides secure connections for various applications.
  • UART interface, 3 x PWM supported, Main Crystal: 32MHz, Temperature sensor supported, 12 bits ADC supported for 8CH input ports and battery voltage detection, Wake up by any GPIO, Average current: TX 3.87mA/RX 3.06mA with Buck, @ VBAT=3.0V and 18.75ms Connection Interval, RSSI Monitor, ISM Band 2.402 to 2.480 GHz operation, Channels 0-39, Rx Sensitivity: -90 dBm@ BLE, in typical, Tx Power: +2 dBm, and Ceramic Chip Antenna (BM70BLES1FC2): Provides a comprehensive set of features for various applications.
  • External Antenna Connection (BM70BLE01FC2): Enables the use of external antennas for improved performance.

Applications

  • Efficient industrial automation, Healthcare devices, Asset tracking, IoT devices, Wearable tech, Home automation, Energy management, and Automotive solutions: Provides a comprehensive set of applications for various industries.
  • Sensor networks: Enables the integration with various sensors for monitoring and control applications.

Advantages and Disadvantages

Advantages: Global compatibility, secure connections, comprehensive set of features, and improved performance.

Disadvantages: Limited information available on the specific use cases for this module.

Equivalents

For similar functionalities, consider these alternatives to the BM70BLES1FC2-0B04AA:

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Bluetooth Classic-Data/SPP No Bluetooth Classic-Audio No
Bluetooth Low-Energy Yes On Board Antenna Yes
On Board Shield Yes BT SIG Certified Yes
FCC Certified Yes Unshielded Option Available Yes
Host Interface UART ASCII Interface No
Audio Channels No Analog Audio Out No
Digital Audio Out No MIC-in 0
Line-in No SPI No
PWM 3 ADC Channels 8
Security AES128 Temp Sensor Yes
RSSI Yes Rx Sensitivity -90 dBM
Memory Type Flash Tx Power +2
GPIO 18 Pin Count 33
Package Type Surface mount module Package Size 22 x 12 x 2.4 mm
Temp Range Min -40C Temp Range Max +85C
Operation Voltage Min 1.9V Operation Voltage Max 3.6V
Bluetooth Version 5.0

Warranty & Returns

Warranty, Returns, and Additional Information

  • QA & Return Policy

    Parts Quality Guarantee: 365 days

    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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    Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.

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