BGM220SC22HNA2
Wireless SiP module
Inventory:7,247
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Part Number : BGM220SC22HNA2
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Package/Case : 44-SMDModule
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Manufacturer : Silicon Labs
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Components Classification : RF Transceiver Modules and Modems
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Datesheet : BGM220SC22HNA2 DataSheet (PDF)
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Series : BGM220
Overview of BGM220SC22HNA2
The BGM220SC22HNA2 is a Bluetooth Low Energy (BLE) SoC chip optimized for low power consumption, wireless communication, and secure data protection. It provides excellent performance for IoT devices, wearables, and other low-power applications.
Pinout
The BGM220SC22HNA2 pinout refers to the configuration and function of each pin in its LGA-44 package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the BGM220SC22HNA2 has a specific role such as power supply input, ground connection, or signal interface.
Features
- Low Power Consumption: Enables battery-operated devices to operate for extended periods of time.
- Integrated BLE Radio: Allows for wireless communication and seamless connectivity.
- Secure Boot and Flash Storage: Ensures secure data protection and reliable storage.
- MESH Networking Support: Enables connection of multiple devices and efficient data transfer.
- Small Form Factor: Facilitates easy integration into compact designs without compromising performance.
Applications
- IoT Devices: The BGM220SC22HNA2 is suitable for a wide range of IoT devices, including smart home appliances and industrial sensors.
- Wearables and Smart Home Devices: Its small size, low power consumption, and advanced features make it ideal for adding wireless connectivity to various products.
- Industrial Sensors: The BLE module's reliable and secure communication capabilities make it suitable for industrial applications.
Advantages and Disadvantages
Advantages
- Low Power Consumption: Reduces energy consumption, extending battery life and minimizing environmental impact.
- Wireless Communication: Enables seamless connectivity and data transfer without physical constraints.
- Data Protection: Secure boot and flash storage ensure the integrity of sensitive information.
- Efficient Network Management: MESH networking support enables efficient connection and data transfer between multiple devices.
- Compact Design: The module's small form factor makes it easy to integrate into compact designs without compromising performance.
Disadvantages
- Limited Data Transfer Rate: The BLE protocol has limitations in terms of data transfer rate compared to other wireless connectivity standards.
Equivalents
For similar functionalities, consider these alternatives to the BGM220SC22HNA2:
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Package | Tray | Product Status | Active |
Programmabe | Not Verified | RF Family/Standard | Bluetooth |
Protocol | Bluetooth v5.2 | Modulation | GFSK |
Frequency | 2.4GHz ~ 2.4835GHz | Data Rate | 2Mbps |
Power - Output | 6dBm | Sensitivity | -106.4dBm |
Serial Interfaces | ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART | Antenna Type | Integrated, Chip |
Utilized IC / Part | EFR32BG22 | Memory Size | 512kB Flash, 32kB RAM |
Voltage - Supply | 1.8V ~ 3.8V | Current - Receiving | 4.2mA ~ 4.8mA |
Current - Transmitting | 4.6mA ~ 8.8mA | Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 44-SMD Module |
Base Product Number | BGM220 |
Warranty & Returns
Warranty, Returns, and Additional Information
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QA & Return Policy
Parts Quality Guarantee: 365 days
Returns for refund: within 90 days
Returns for Exchange: within 90 days
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Shipping and Package
Shipping:For example, FedEx, JP, UPS, DHL,SAGAWA, or YTC.
Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.
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Payment
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If you have specific payment channel preferences or requirements, please get in touch with our sales team for assistance.
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