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BGM220SC22HNA2

Wireless SiP module

Inventory:7,247

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Overview of BGM220SC22HNA2

The BGM220SC22HNA2 is a Bluetooth Low Energy (BLE) SoC chip designed for use in IoT devices, wearables, and other low-power applications. It provides excellent performance for wireless communication and data protection.

Pinout

The BGM220SC22HNA2 pinout refers to the configuration and function of each pin in its 44-SMD Module package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the BGM220SC22HNA2 has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • Low power consumption for battery-operated devices: The BGM220SC22HNA2 is designed to consume low power, making it suitable for use in battery-powered devices.
  • Integrated BLE radio for wireless communication: The chip features an integrated Bluetooth Low Energy (BLE) radio for wireless communication.
  • Secure boot and flash storage for data protection: The BGM220SC22HNA2 provides secure boot and flash storage to protect sensitive data.
  • Mesh networking support for connecting multiple devices: The chip supports mesh networking, enabling the connection of multiple devices.
  • Small form factor for easy integration into compact designs: The BGM220SC22HNA2 has a small form factor, making it ideal for use in compact designs.

Applications

  • IoT devices and wearables: The BGM220SC22HNA2 is suitable for use in IoT devices and wearables that require low-power wireless communication.
  • Smart home devices: The chip can be used in smart home devices to enable wireless connectivity.
  • Industrial sensors: The BGM220SC22HNA2 can be used in industrial sensors to provide wireless connectivity and data transmission.

Advantages and Disadvantages

Advantages

  • Low power consumption for extended battery life: The BGM220SC22HNA2's low power consumption enables extended battery life in battery-powered devices.
  • Secure data transmission and storage: The chip provides secure boot and flash storage to protect sensitive data.
  • Easy integration into compact designs: The BGM220SC22HNA2 has a small form factor, making it ideal for use in compact designs.
  • Mesh networking support for connecting multiple devices: The chip supports mesh networking, enabling the connection of multiple devices.

Disadvantages

  • Limited range and data transfer rate: The BGM220SC22HNA2 has a limited range and data transfer rate compared to other wireless communication technologies.

Equivalents

For similar functionalities, consider these alternatives to the BGM220SC22HNA2:

  • Silicon Labs' BGM220SC22HNA1: This chip is a predecessor of the BGM220SC22HNA2 and offers similar features.
  • Other BLE SoC chips from various manufacturers: There are other BLE SoC chips available in the market that offer similar features to the BGM220SC22HNA2.

Frequently Asked Questions

Q: What is the power consumption of the BGM220SC22HNA2?
A: The BGM220SC22HNA2 has a low power consumption, making it suitable for use in battery-powered devices.

Q: Does the BGM220SC22HNA2 support mesh networking?
A: Yes, the BGM220SC22HNA2 supports mesh networking, enabling the connection of multiple devices.

Q: Is the BGM220SC22HNA2 suitable for use in industrial sensors?
A: Yes, the BGM220SC22HNA2 can be used in industrial sensors to provide wireless connectivity and data transmission.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Package Tray Product Status Active
Programmabe Not Verified RF Family/Standard Bluetooth
Protocol Bluetooth v5.2 Modulation GFSK
Frequency 2.4GHz ~ 2.4835GHz Data Rate 2Mbps
Power - Output 6dBm Sensitivity -106.4dBm
Serial Interfaces ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART Antenna Type Integrated, Chip
Utilized IC / Part EFR32BG22 Memory Size 512kB Flash, 32kB RAM
Voltage - Supply 1.8V ~ 3.8V Current - Receiving 4.2mA ~ 4.8mA
Current - Transmitting 4.6mA ~ 8.8mA Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TA) Package / Case 44-SMD Module
Base Product Number BGM220

Warranty & Returns

Warranty, Returns, and Additional Information

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