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BGM13S22F512GA-V3R

SiP module solution for Bluetooth 5 connectivity

Quantity Unit Price(USD) Ext. Price
1000 $4.146 $4,146.00
500 $4.222 $2,111.00
200 $4.375 $875.00
1 $11.305 $11.30

Inventory:9,875

*The price is for reference only.
  • 90-day after-sales guarantee
  • 365 Days Quality Guarantee
  • Genuine Product Guarantee
  • 7*24 hours service quarantee

Rapid Quote

Submit your quote request for BGM13S22F512GA-V3R using this form.You can also reach us via email at Email: [email protected], and we will respond within 12 hours.

Overview of BGM13S22F512GA-V3R

The BGM13S22F512GA-V3R is a highly integrated, ultra-low-power SiP (System in Package) module featuring a Bluetooth 5.2 stack and a 2.4GHz radio, designed for IoT and wearable applications. This module combines a powerful 32-bit Arm Cortex-M4 microcontroller and a wide range of peripherals, making it an ideal solution for wireless connectivity and sensor hubs in energy-efficient devices.

Pinout

(Note: The pin configuration below is a general representation. Refer to the specific datasheet for precise details.)

  • VDD: Power Supply Input
  • GND: Ground Connection
  • GPIO: General-Purpose Input/Output Pin
  • RST: Reset Pin
  • ADC: Analog-to-Digital Converter Input
  • UART: Universal Asynchronous Receiver-Transmitter
  • SPI: Serial Peripheral Interface
  • I2C: Inter-Integrated Circuit
  • ANT: Antenna Connection

Circuit Diagram

Include a circuit diagram illustrating the connections and operation of the BGM13S22F512GA-V3R SiP module for a visual representation.

Key Features

  • Bluetooth 5.2: Supports the latest Bluetooth technology for reliable and low-power wireless communication.
  • Ultra-Low Power: The SiP module is designed for energy-efficient operation, extending battery life in IoT and wearable devices.
  • Integrated MCU: Features a powerful 32-bit Arm Cortex-M4 microcontroller for advanced processing capabilities.
  • Wide Range of Peripherals: Includes GPIO, ADC, UART, SPI, and I2C interfaces for flexible connectivity and sensor integration.
  • Compact Form Factor: The SiP module's compact size makes it suitable for space-constrained applications.

Note: For detailed technical specifications, please refer to the BGM13S22F512GA-V3R datasheet.

Application

  • IoT Devices: Ideal for IoT applications requiring Bluetooth connectivity and sensor integration.
  • Wearable Technology: Suitable for wearable devices such as smartwatches and fitness trackers that demand low-power wireless connectivity.
  • Wireless Sensor Hubs: The BGM13S22F512GA-V3R serves as an effective solution for wireless sensor hubs in energy-efficient systems.

Functionality

The BGM13S22F512GA-V3R SiP module integrates a Bluetooth 5.2 stack, a powerful MCU, and various peripherals to provide efficient wireless connectivity and sensor hub capabilities in energy-efficient IoT and wearable devices.

Usage Guide

  • Power Supply: Connect VDD (Power Supply Input) to the appropriate power source (refer to the datasheet for voltage requirements).
  • Antenna Connection: Ensure proper connection of the antenna to the ANT pin for optimal wireless performance.
  • Peripheral Integration: Utilize the GPIO, ADC, UART, SPI, and I2C interfaces as needed for sensor integration and communication.

Frequently Asked Questions

Q: What is the maximum range of Bluetooth connectivity for the BGM13S22F512GA-V3R?
A: The BGM13S22F512GA-V3R module supports Bluetooth connectivity with a typical range of up to 200 meters in line of sight.

Q: Can the BGM13S22F512GA-V3R be used in battery-powered IoT devices?
A: Yes, the ultra-low-power design of the BGM13S22F512GA-V3R makes it well-suited for battery-powered IoT applications, extending the operational lifetime of devices.

Equivalent

For similar functionalities, consider these alternatives to the BGM13S22F512GA-V3R:

  • BGM220S: Another SiP module offering Bluetooth 5.2 connectivity and a compact form factor suitable for IoT and wearable applications.
  • BGM210P: This SiP module features ultra-low power consumption and integrated Bluetooth 5.2 connectivity, catering to energy-efficient wireless applications.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category Bluetooth Modules - 802.15.1 RoHS Details
Series BGM13S Protocol Bluetooth 5.0
Class Bluetooth Low Energy (BLE) Interface Type I2C, UART
Output Power 8 dBm Data Rate 2 Mb/s
Receiver Sensitivity - 90.2 dBm Frequency 2.44 GHz
Supply Voltage - Min 1.8 V Supply Voltage - Max 3.8 V
Minimum Operating Temperature - 40 C Maximum Operating Temperature + 85 C
Antenna Chip Brand Silicon Labs
Core ARM Cortex M4 Dimensions 6.5 mm x 6.5 mm x 1.4 mm
Frequency Range 2.4 GHz to 2.4835 GHz Height 1.4 mm
Length 6.5 mm Memory Size 64 kB, 512 kB
Modulation GFSK Modulation Technique GFSK
Moisture Sensitive Yes Mounting Style SMD/SMT
Operating Supply Voltage 1.8 V to 3.8 V Product Type Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1 Bluetooth, BLE Sensitivity - 90.2 dBm
Factory Pack Quantity 1000 Subcategory Wireless & RF Modules
Supply Current Receiving 9.7 mA Supply Current Transmitting 8.9 mA
Type USB Adapter Width 6.5 mm
Unit Weight 0.056257 oz

Warranty & Returns

Warranty, Returns, and Additional Information

  • QA & Return Policy ?

    Parts Quality Guarantee: 365 days

    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

  • Shipping and Package ?

    Shipping:For example, FedEx, JP, UPS, DHL,SAGAWA, or YTC.

    Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.

  • Payment ?

    For example, channels like VISA,MasterCard,Western Union,PayPal,MoneyGram,Rakuten Pay and more.

    If you have specific payment channel preferences or requirements, please get in touch with our sales team for assistance.

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BGM13S22F512GA-V3R

SiP module solution for Bluetooth 5 connectivity

Inventory:

9,875
Overview of BGM13S22F512GA-V3R Specifications Warranty & Returns Similar Products Popular Products

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After Sales Service

What after-sales service can be provided?

We provide an extended quality assurance period of 365 days for all components we offer. If a return or exchange becomes essential, kindly adhere to these guidelines:

·Initiate the request within 90 days after the item's shipment date.

·Coordinate the return or exchange with our team.

·Keep the items in their original condition as delivered.

·Please be aware that the feasibility of returning or exchanging items is contingent upon an evaluation of their actual state upon return.

Shipping

What channels of transportation of goods does the website support?

We usually send out our orders during business days using FedEx, SF, UPS, or DHL. We're also here to assist with alternative shipping options. Should you require additional information about shipping particulars or expenses, please don't hesitate to get in touch with us.

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Package

How to ensure that the parts will be intact during transportation?

The items we ship will be packaged in anti-static bags, ensuring ESD anti-static protection, while the outer packaging boasts exceptional durability and sealing. We offer packaging options like Tape and Reel, Cut Tape, Tube, or Tray to suit your needs.

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Payment

Which payment methods can be used to pay for goods

Accepted payment methods commonly encompass VISA, MasterCard, UnionPay, Western Union, PayPal, and various other options.

Should you have a particular payment preference or wish to seek information on rates and other specifics, please feel free to reach out to us.

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