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AS4C256M16D3B-12BIN

DDR DRAM, 256MX16, CMOS, PBGA96, FBGA-96

Inventory:4,922

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Overview of AS4C256M16D3B-12BIN

Key Features

AUTO/SELF REFRESH

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code Yes Part Life Cycle Code End Of Life
Ihs Manufacturer ALLIANCE MEMORY INC Package Description TFBGA,
Reach Compliance Code compliant ECCN Code EAR99
HTS Code 8542.32.00.36 Samacsys Manufacturer Alliance Memory
Access Mode MULTI BANK PAGE BURST Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B96 JESD-609 Code e1
Length 13.5 mm Memory Density 4294967296 bit
Memory IC Type DDR3 DRAM Memory Width 16
Moisture Sensitivity Level 3 Number of Functions 1
Number of Ports 1 Number of Terminals 96
Number of Words 268435456 words Number of Words Code 256000000
Operating Mode SYNCHRONOUS Operating Temperature-Max 85 °C
Operating Temperature-Min Organization 256MX16
Package Body Material PLASTIC/EPOXY Package Code TFBGA
Package Shape RECTANGULAR Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 Seated Height-Max 1.2 mm
Self Refresh YES Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES Technology CMOS
Temperature Grade OTHER Terminal Finish TIN SILVER COPPER
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 30
Width 9 mm

Warranty & Returns

Warranty, Returns, and Additional Information

  • QA & Return Policy

    Parts Quality Guarantee: 365 days

    Returns for refund: within 90 days

    Returns for Exchange: within 90 days

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    Parts Packaging Guarantee: Featuring 100% ESD anti-static protection, our packaging incorporates high toughness and superior buffering capabilities.

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