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AS4C16M16S-7BCN

Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-54

Inventory:6,053

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Please submit RFQ for AS4C16M16S-7BCN or email to us: Email: [email protected], we will contact you in 12 hours.

Overview of AS4C16M16S-7BCN

Features• Organization: 1,048,576 words × 4 bits• High speed - 40/50/60/70 ns RAS access time - 20/25/30/35 ns column address access time - 10/13/15/18 ns CAS access time• Low power consumption - Active: 385 mW max (-60) - Standby: 5.5 mW max, CMOS I/O• Fast page mode (AS4C14400) or EDO (AS4C14405)• 1024 refresh cycles, 16 ms refresh interval - RAS-only or CAS-before-RAS refresh• Read-modify-write• TTL-compatible, three-state I/O• JEDEC standard packages - 300 mil, 20/26-pin SOJ - 300 mil, 20/26-pin TSOP• Single 5V power supply• ESD protection ≥ 2001V• Latch-up current ≥ 200 mA

Key Features

  • Organization: 1,048,576 words × 4 bits
  • High speed
  • - 40/50/60/70 ns RAS access time
  • - 20/25/30/35 ns column address access time
  • - 10/13/15/18 ns CAS access time
  • Low power consumption
  • - Active: 385 mW max (-60)
  • - Standby: 5.5 mW max, CMOS I/O
  • Fast page mode (AS4C14400) or EDO (AS4C14405)
  • 1024 refresh cycles, 16 ms refresh interval
  • - RAS-only or CAS-before-RAS refresh
  • Read-modify-write
  • TTL-compatible, three-state I/O
  • JEDEC standard packages
  • - 300 mil, 20/26-pin SOJ
  • - 300 mil, 20/26-pin TSOP
  • Single 5V power supply
  • ESD protection ≥ 2001V
  • Latch-up current ≥ 200 mA

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Obsolete Ihs Manufacturer ALLIANCE MEMORY INC
Part Package Code BGA Package Description TFBGA,
Pin Count 54 Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.32.00.24
Samacsys Manufacturer Alliance Memory Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.4 ns Additional Feature AUTO/SELF REFRESH
JESD-30 Code S-PBGA-B54 Length 8 mm
Memory Density 268435456 bit Memory IC Type SYNCHRONOUS DRAM
Memory Width 16 Number of Functions 1
Number of Ports 1 Number of Terminals 54
Number of Words 16777216 words Number of Words Code 16000000
Operating Mode SYNCHRONOUS Operating Temperature-Max 70 °C
Operating Temperature-Min Organization 16MX16
Package Body Material PLASTIC/EPOXY Package Code TFBGA
Package Shape SQUARE Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED Seated Height-Max 1.2 mm
Self Refresh YES Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES Technology CMOS
Temperature Grade COMMERCIAL Terminal Form BALL
Terminal Pitch 0.8 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Warranty, Returns, and Additional Information

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