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AS4C128M16D3LB-12BCN

AS4C128M16D3LB-12BCN, DDR DRAM, 128MX16, CMOS, PBGA96, FBGA-96

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Overview of AS4C128M16D3LB-12BCN

AS4C128M16D3LB-12BCN is a SDRAM optimized for high-speed and low-voltage operations. It provides excellent performance for computer systems, servers, networking equipment, industrial applications, medical equipment, automotive systems, telecommunications, military and aerospace technology, consumer electronics, and embedded systems.

Pinout

The AS4C128M16D3LB-12BCN pinout refers to the configuration and function of each pin in its FBGA-96 package. This package typically includes a diagram showing the layout of the pins when viewed from the top down with pins named sequentially. Each pin on the AS4C128M16D3LB-12BCN has a specific role such as power supply input, ground connection, or signal interface. The pinout details are crucial for integrating this component into a circuit as they ensure correct connections for optimal device performance. Designers and engineers must refer to the datasheet provided by the manufacturer to get accurate information regarding each pin's function and electrical characteristics.

Features

  • Optimal thermal management: Provides efficient heat dissipation for reliable operation in high-temperature environments.
  • Versatile application: Suitable for various applications including computer systems, servers, networking equipment, and more.
  • Streamlined assembly: Offers simplified assembly process with improved yield rates.
  • Robust build quality: Built with high-quality materials to ensure reliable performance under various conditions.
  • Enhanced functionality: Integrated memory IC design for enhanced read and write speeds.
  • Reliable data storage: Designed to store large amounts of data efficiently and securely.
  • User-friendly interface: Easy integration with various systems and peripherals.
  • Cost-effective solution: Offers a cost-effective memory solution for various applications.
  • Efficient power usage: Designed to consume low power while maintaining high performance.
  • Durable construction: Built with durable materials to withstand harsh environments and conditions.
  • Advanced technology: Utilizes advanced memory technology for improved read and write speeds and reduced power consumption.
  • Top-notch performance: Delivers high-speed data transfer rates and fast access times.
  • Exceptional reliability: Designed to provide high reliability and low error rates in various applications.
  • Compact design: Offers a compact form factor for easy integration into systems.
  • High-speed operation: Enables fast data transfer and processing speeds.
  • Sleek appearance: Features a sleek, modern design for improved aesthetics.
  • Long-lasting performance: Designed to maintain high performance over an extended period of time.

Applications

  • Computer systems: Ideal for use in computer systems, servers, and workstations.
  • Servers: Suitable for use in server applications where high-speed data transfer rates are required.
  • Networking equipment: Utilized in networking equipment such as routers, switches, and modems.
  • Industrial applications: Provides reliable performance in industrial environments such as manufacturing, healthcare, and transportation systems.
  • Medical equipment: Used in medical devices and equipment where high-performance memory is required.
  • Automotive systems: Utilized in automotive systems and applications where high-speed data transfer rates are needed.
  • Telecommunications: Suitable for use in telecommunications equipment and networks where high-speed data transfer rates are essential.
  • Military and aerospace technology: Utilized in military and aerospace applications where high-performance memory is required for critical systems.
  • Consumer electronics: Ideal for use in consumer electronic devices such as smartphones, tablets, and PCs.
  • Embedded systems: Provides reliable performance in embedded systems and applications where high-speed data transfer rates are needed.

Equivalents

  • Competing products from other manufacturers: Other manufacturers may offer similar products with different specifications, pricing, and features.

Frequently Asked Questions

Q: What is the capacity of the AS4C128M16D3LB-12BCN?
A: The memory chip has a capacity of 128MB.

Q: Is the AS4C128M16D3LB-12BCN compatible with different systems?
A: Yes, it is designed to be compatible with various systems and applications.

Q: What is the power consumption of the AS4C128M16D3LB-12BCN?
A: The memory chip consumes low power while maintaining high performance.

Q: Is the AS4C128M16D3LB-12BCN reliable in different environments?
A: Yes, it is designed to provide high reliability and low error rates in various applications and environments.

Q: Can I use the AS4C128M16D3LB-12BCN for other applications beyond computer systems?
A: Yes, it can be utilized in various applications such as industrial, medical, automotive, telecommunications, military, and aerospace settings where high-speed data transfer rates are needed.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Package Tray Product Status Obsolete
Programmabe Not Verified Memory Type Volatile
Memory Format DRAM Technology SDRAM - DDR3L
Memory Size 2Gbit Memory Organization 128M x 16
Memory Interface Parallel Clock Frequency 800 MHz
Write Cycle Time - Word, Page 15ns Access Time 20 ns
Voltage - Supply 1.283V ~ 1.45V Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount Package / Case 96-VFBGA
Supplier Device Package 96-FBGA (8x13) Base Product Number AS4C128

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