5CSEMA2U23I7N

Overview of Intel 5CSEMA2U23I7N Cyclone V SoC FPGA

The Intel 5CSEMA2U23I7N is a high-performance, dual-core SoC FPGA designed for embedded systems requiring robust processing and flexible logic integration. This component combines a hardened dual-core ARM Cortex-A9 processor subsystem, operating at up to 925 MHz, with 25,000 logic elements of Intel's proven FPGA fabric. It delivers a balanced architecture with 1.37 Mbits of embedded memory, 145 user I/Os, and support for an extensive operating temperature range from -40°C to +100°C, making it a durable and reliable chip for harsh environments. Part of the power-efficient Cyclone V series, this SoC FPGA is ideal for applications in industrial automation, motor control, vision systems, and communications infrastructure, where its high-efficiency processing and customizable logic enable rapid prototyping and system consolidation.

Manufacturer Information

Intel Corporation is a world leader in the design and manufacturing of silicon-based technologies. Following its acquisition of Altera, Intel's Programmable Solutions Group (PSG) continues to be a dominant force in the FPGA and programmable logic market. The company leverages its advanced process technology and system-level expertise to deliver a comprehensive portfolio of high-performance, power-efficient FPGA, SoC FPGA, and complementary power management and configuration devices. Intel's components are developed to meet rigorous quality and reliability standards for global deployment across diverse industries.

Key Features

• Integrates a dual-core ARM Cortex-A9 MPCore processor, achieving high-performance application processing at 925 MHz.
• Features 25,000 logic elements (9430 ALMs) for implementing custom digital logic and system integration.
• Provides robust thermal performance with an operating temperature range from -40°C to +100°C.
• Includes substantial on-chip memory with 1.37 Mbits for data buffering and processor code execution.
• Offers 145 user I/O pins supporting various interface standards for peripheral connectivity.
• Optimizes power consumption with a core operating voltage of 1.1V for energy-efficient designs.

Packaging Details

UBGA-672 (Ultra Fine-Pitch Ball Grid Array) package. This SMD/SMT package is designed for high-density PCB mounting and is compatible with standard surface-mount technology assembly processes.

Equivalent / Alternative Parts

• 5CSEMA4U23I7N (Intel) - Higher logic density (40K LE) with similar processor core and package.
• 5CSEMA5U23I7N (Intel) - Higher logic density (85K LE) and memory, same ARM core and temperature grade.

Advantages

• Superior thermal robustness with a -40°C to +100°C range outperforms many commercial-grade FPGAs, enabling deployment in industrial and automotive environments.
• The hardened ARM Cortex-A9 processor subsystem eliminates the soft-core processor overhead, providing higher and more deterministic performance for real-time applications.
• Combines substantial programmable logic (25K LE) with a processor system, offering greater design flexibility and integration potential than discrete MCU+FPGA solutions.

Lifecycle Status & Updates

Stable supply. For the latest product change notifications (PCN) or discontinuation information, please consult the official Intel FPGA website or contact authorized distributors.

Application Examples

• Motor Control Drives (Industrial Automation)
• Embedded Vision Systems (Machine Vision)
• Protocol Bridging Gateways (Communications)
• Avionics Interface Modules (Aerospace)
• Portable Medical Devices (Medical Electronics)
• Automotive Driver Assistance (Automotive)

Technical Specifications

• Product Category: SoC FPGA
• Core Processor: ARM Cortex-A9 Dual-Core @ 925 MHz
• Programmable Logic: 25,000 Logic Elements
• Embedded Memory: 1.37 Mbit
• User I/O: 145
• Operating Voltage: 1.1 V
• Operating Temperature: -40°C to +100°C
• Package: UBGA-672

Pinout and Functionality

• Pin configuration is specific to the UBGA-672 package. Functions are assigned to bank groups supporting I/O standards like LVCMOS, LVDS, and SSTL. Typical applications include connecting to DDR3 memory, Gigabit Ethernet PHYs, and general-purpose peripherals. Refer to the official Intel Cyclone V Device Handbook for the complete pinout table and bank diagrams.

FAQ Section

Q:What is the processor core?
A: Dual ARM Cortex-A9, up to 925 MHz.

Q:What is the logic capacity?
A: 25,000 logic elements (LE).

Q:What is the temperature range?
A: Industrial grade, -40°C to +100°C.

Q:How much on-chip memory?
A: 1.37 Mbits embedded memory.

Q:What is the package type?
A: UBGA-672, SMD mount.

Q:Is it RoHS compliant?
A: See "Details" in specifications.