DFN-3

(3)
DFN-3

The x2dfn-3 (Extra Extra Small Dual Flat No-leads Package) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With its 3-lead configuration, this package is designed for thermal efficiency and minimal footprint, making it ideal for space-constrained applications in various sectors such as telecommunications, automotive, and consumer electronics.

Part Number Description Manufacturers Inventory Add To Bom
NST4617MX2T5G Small signal transistor for general-purpose applicatio onsemi 7,766
NST3906MX2T5G PBFREE construction offers excellent radiation hardness and immunity from electromagnetic interference onsemi 7,561
NST3904MX2T5G High-gain amplifier for audio and RF application onsemi 6,608