DFN-3
(3)
The x2dfn-3 (Extra Extra Small Dual Flat No-leads Package) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With its 3-lead configuration, this package is designed for thermal efficiency and minimal footprint, making it ideal for space-constrained applications in various sectors such as telecommunications, automotive, and consumer electronics.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
NST4617MX2T5G | Small signal transistor for general-purpose applicatio | onsemi | 7,766 | |
NST3906MX2T5G | PBFREE construction offers excellent radiation hardness and immunity from electromagnetic interference | onsemi | 7,561 | |
NST3904MX2T5G | High-gain amplifier for audio and RF application | onsemi | 6,608 |