WLP-72
(2)
The WLP-72 (Wafer Level Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 72-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| MAX77818EWZ+T | MAX77818EWZ+T offers customized power solutions for the dynamic needs of modern smartphones | Analog Devices | 9,531 | |
| MAX77818EWZ+ | Advanced features for optimizing power consumption | Analog Devices Inc./Maxim Integrated | 7,647 |