BGA-388
(4)
The TE-PBGA-388 (Tape-Extender Plastic Ball Grid Array) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 388-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| MCF5485CVR200 | MCF5485CVR200 32-Bit RISC MPU | Freescale Semiconductor | 8,508 | |
| MCF5485CZP200 | Coldfire V4E MCF548x Microcontroller IC | NXP Semiconductors | 8,520 | |
| MCF5484CVR200 | MPU MCF548X V4ECORE MMU FPU | Freescale Semiconductor | 8,240 | |
| MCF5482CVR166 | MPU with MMU and FPU features | NXP Semiconductors | 6,287 |