SOIC-14
(2)
The SOP-W-14 (Small Outline Package Wide) provides a dependable and space-efficient packaging solution for integrated circuits in modern electronic systems. With a wide 14-lead configuration, this package is designed for optimal thermal efficiency and reliability, making it suitable for various applications in the telecommunications, automotive, and consumer electronics industries.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
CD4066BCSJ | Compact SOIC-14 package suitable for space-constrained applications | Onsemi | 3,163 | |
CD4069UBCSJX | Compact -pin SOP design enables seamless integration into system | Onsemi | 3,059 |