VQFN-12
(4)
The MLPQ-EP-12 (Micro Leadframe Package with Exposed Pad) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With 12 leads and an exposed pad design, this package is optimized for thermal efficiency and minimal footprint, making it ideal for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
AS7620A-BQFT | Conv DC-DC 3.6V to 32V Synchronous Step Down Single-Out 3.3V 0.5A 12-Pin MLPQ EP T/R | Ams Osram | 3,131 | |
LX5561LL-TR | Multi-purpose amplification solution for wireless communication devices | Microchip Technology | 4,353 | |
LX5560LL-TR | High-frequency amplifier for precise RF signal processing, suitable for a wide range of applications | Microchip Technology | 5,457 | |
LX5560LL | High-frequency amplifier module for RF application | Microchip Technology | 4,664 |