MLP55-31
(7)
The MLP55-31 (Micro Leadframe Package 55-31) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 31-lead configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| SIC642CD-T1-GE3 | Advanced MLP-L device for precise control of high-voltage power system | Vishay | 6,485 | |
| SIC641ACD-T1-GE3 | A highly efficient power management solution for demanding applications | Vishay | 6,405 | |
| SIC642ACD-T1-GE3 | Compact 31-pin package ideal for space-constrained designs | Vishay | 4,589 | |
| SIC652ACD-T1-GE3 | High-power switching voltage regulator for demanding applications, featuring a robust A current rating and compact MLP package desig | Vishay | 4,507 | |
| SIC651CD-T1-GE3 | High-power switching regulator for demanding applications | Vishay | 2,389 | |
| SIC621CD-T1-GE3 | 31-pin PowerPAK MLP EP packaged low-side half-bridge driver with a single output, suitable for various applications | Siliconix | 2,346 | |
| SIC641CD-T1-GE3 | SIC641CD-T1-GE3 offers efficient power management with 55A DrMOS technology | Vishay | 5,719 |