MLP EP

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MLP EP

The MLP-EP (Micro Leadframe Package Exposed Pad) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With its exposed pad design for enhanced thermal performance and minimal footprint, this package is well-suited for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
SKY16601-555LF High-frequency PIN diodes for efficient switching applications Skyworks 5,645
FDMQ8205A Low On-State Resistance Onsemi 4,911