MLP EP
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The MLP-EP (Micro Leadframe Package Exposed Pad) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With its exposed pad design for enhanced thermal performance and minimal footprint, this package is well-suited for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
SKY16601-555LF | High-frequency PIN diodes for efficient switching applications | Skyworks | 5,645 | |
FDMQ8205A | Low On-State Resistance | Onsemi | 4,911 |