QFP-100
(5)
The MAXQFP (Quad Flat Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this quad flat configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
S32K342EHT0MPBST | Compact and Power-Efficient Design for Real-Time System | NXP USA Inc. | 6,029 | |
S32K341EHT0MPBST | Advanced ARM Core Technology for Fast Execution and Low Power Consumption | NXP USA Inc. | 6,171 | |
S32K322EHT0MPBST | -bit MCU with high-speed processing and robust memor | NXP USA Inc. | 8,259 | |
S32K322EHT0MPAST | Robust CANFD Connectivity for Real-Time Communicatio | NXP USA Inc. | 9,941 | |
S32K342EHT0MPAST | S32K342 Arm Cortex-M7, 160 MHz, 2 MB Flash, CAN FD, Ethernet, HSE B security, 100 HDQFP - S32K MCUs for General Purpose | NXP USA Inc. | 8,649 |