LGA-18
(4)
The LGA-18 (Land Grid Array Package) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 18-lead configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
ADXRS290BCEZ | MEMS Dual Axis 18-Pin LGA Tray | Analog Devices | 5,593 | |
MPM3550EGLE | Voltage Regulator | Monolithic Power Systems (Mps) | 7,143 | |
RFFM6909TR13 | Low Noise, High Gain RF Front End Solution for Hz Applicatio | Qorvo | 5,735 | |
RFFM6909SR | High-frequency amplifier module for RF applicatio | Qorvo | 5,440 |