LFCSP-16
(3)
The LFCSPEP (Lead Frame Chip Scale Package Exposed Pad) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this exposed pad configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| AD8231ACPZ | The device comes in a 16-pin lead frame chip scale package with enhanced pin compatibility for easy installation and connection | Analog Devices | 6,605 | |
| ADT7420UCPZ | Digital Temperature Sensor | Analog Devices | 7,541 | |
| HMC941LP4E | Precise 0.5dB step attenuation with 15.5dB range | Analog Devices | 9,064 |