BGA-324
(4)
The HSBGA (Heat Spreader Ball Grid Array) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for optimal thermal management and space efficiency, this configuration is ideal for various applications in telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| PI7C9X2G1616PRBHSBE | 16-lane PCI Express switch with 16 ports and 4 channels in a 324-pin HSBGA package | Diodes Incorporated | 9,377 | |
| VSC8244XHG | Transceiver for Ethernet communication in CMOS, PBGA260 | Microchip Technology | 9,860 | |
| STDP8028-AB | The STDP8028-AB is a tray of advanced video processing technology with a total of 409 pins in a compact HSBGA form factor | STMicroelectronics NV | 8,015 | |
| DS34S108GN+ | Telecom Interface ICs Single/Dual/Quad/Octal TDM-Over-Packet Transport Devices | Analog Devices Inc./Maxim Integrated | 5,016 |