FCBGA-1031

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FCBGA-1031

The FCBGA-1031 (Flip Chip Ball Grid Array) provides a high-density, high-reliability packaging solution for integrated circuits in advanced electronic systems. With 1031 solder balls for secure connections, this configuration is designed for optimal thermal efficiency and minimal footprint. Ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
TMS320DM8169MCYG4 Digital Signal Processors & Controllers Texas Instruments 5,953
TMS320DM8168CCYG Digital Media Processor Texas Instruments 8,770
TMS320DM8167BCYG2 A powerful digital processor for high-performance computing and multimedia applications Texas Instruments 7,864
TMX320DM8168ACYG Unlock enhanced multimedia capabilities with precision digital signal processing Texas Instruments 2,034
TMS320DM8168CCYGA2 DSP processor with floating-point capabilities, running at 1.1GHz and delivering 8000 million instructions per second in a 1031-pin FCBGA package Texas Instruments 6,229
AM3894CCYGA120 Microprocessors - MPU Sitara ARM MPU Texas Instruments 7,459
TMS320DM8168CCYG2 DSP Floating-Point 32bit 1.1GHz 8000MIPS 1031-Pin FCBGA Tray Texas Instruments 3,209
TMS320DM8168SCYGA2 DSP Floating-Point 32bit 1.1GHz 8000MIPS 1031-Pin FCBGA Tray Texas Instruments 5,597
TMS320DM8168CCYG4 Digital signal processor with floating-point capabilities, running at 1 Texas Instruments 7,461
AM3894BCYG150 High-performance RISC microprocessor for demanding application Texas Instruments 4,916