BGA-484
(2328)
The FBGA (Fine-pitch Ball Grid Array) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this ball grid array configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| EP2C20F484C7 | Field Programmable Gate Array | Intel | 5,763 | |
| EP3C25F324C6N | High performance 500MHz FPGA | Intel | 6,951 | |
| MT41K128M16JT-125 AIT:K | DRAM Chip DDR3L SDRAM 2Gbit 128Mx16 1.35V Automotive 96-Pin FBGA Tray | Micron Technology | 5,758 | |
| CY7C1071DV33-12BAXI | SRAM device with 32MB capacity, operating temperature between -40 and 85 degrees C | Infineon Technologies | 6,937 | |
| CYUSB2014-BZXI | USB Interface IC 32-bit 512KB RAM FX3 SuprSped USB Con | Infineon Technologies | 8,523 | |
| CYUSB3064-BZXC | Super Speed Host Controller USB 2.0/USB 3.0 | Infineon Technologies | 5,674 | |
| SDIN7DP2-4G | High-density storage solution | Sandisk | 9,156 | |
| MT47H128M16HG-3IT:A | 128Mx16 configuration | Micron Technology | 9,468 | |
| K4B1G0846I-BCK0 | Industry-leading speed, capacity, and power management capabilitie | SAMSUNG | 3,725 | |
| MT61K512M32KPA-21:U | Get ready for unparalleled graphics and computing power with MT61K512M32KPA-21:U | Micron Technology Inc. | 8,024 | |
| A3PE3000L-FG484M | Cutting-edge technology offering 75264-Cell configuration and 3000000 Gates | MICROCHIP | 4,114 | |
| EP2C70F896C8N | 90nm Technology | Intel | 7,767 | |
| A3P1000-FGG256 | Versatile and customizable field-programmable gate array | Microchip Technology | 9,805 | |
| EPM2210GF256C3N | Technology: 0.18um | Intel | 5,931 | |
| M2GL025T-1FG484M | FPGA IGLOO®2 Family 27696 Cells 1.2V 484-Pin FBGA Tray | Microchip Technology | 5,972 | |
| 5CEFA7F31I7N | ROHS compliant CPLDs/FPGAs | Intel | 5,687 | |
| A3P1000-FG484 | FPGA ProASIC®3 Family 1M Gates 231MHz 130nm Technology 1.5V 484-Pin FBGA Tray | Microchip Technology | 5,914 | |
| EP1C20F400C8 | The EP1C20F400C8 FPGA offers high performance at a competitive price | Intel | 5,365 | |
| EP1S20F672C6N | The EP1S20F672C6N is a programmable logic device that comes in a FBGA-672 package, making it suitable for a wide range of applications | Intel | 9,589 | |
| EP2C35F672C8 | Cyclone II Field Programmable Gate Array with 475 483840 33216 components | Intel | 7,185 | |
| EP2C20F484C6 | Programmable logic device used for designing custom digital circuits | Intel | 6,931 | |
| EP4CE15F23C8 | Field-programmable gate array featuring 963 CLBs and a maximum of 15408 cells | Intel | 7,995 | |
| EP4CE30F29I7 | 60nm Technology and 1.2V | Altera | 9,265 | |
| EPM2210F324I5 | CPLD MAX® II Family 1700 Macro Cells 201.1MHz 0.18um Technology 2.5V/3.3V 324-Pin FBGA Tray | Intel | 8,935 | |
| EPM570GF100C5N | The device operates at a voltage of 1.8V and comes in a 100-Pin FBGA Tray packaging | Intel | 7,170 | |
| MPF100T-FCVG484I | FPGA PolarFire Family 109000 Cells 28nm Technology 484-Pin FBGA Tray | Microchip Technology | 5,810 | |
| AGL250V2-FGG144I | 130nm CMOS Technology | Microchip Technology | 7,278 | |
| EPM570F256I5 | Flash Programmable Logic Device, 8.7 nanoseconds, 440-Cell, CMOS, Plastic Ball Grid Array 256 | Intel | 7,610 | |
| EP2C20F256I8N | IC CYCLONE II FPGA | Intel | 8,828 | |
| EP2C35F672C7N | Reconfigurable computing hardware | Intel | 6,680 | |
| EP2C70F672C8N | Environmentally-friendly ROHS-compliant CPLD/FPGA | Intel | 6,274 | |
| EP3C10F256I7 | FPGA Cyclone® III Family 10320 Cells 437.5MHz 65nm Technology 1.2V | Intel | 6,161 | |
| EP3C120F780C8 | EP3C120F780C8 - Field Programmable Gate Array (FPGA) | Intel | 7,428 | |
| EP3C16F256C7N | FPGA EP3C16F256C7N | Intel | 8,894 | |
| EP3C25F324C6 | Programmable Logic Device EP3C25F324C6 24624 1539 FBGA-324 ROHS | Intel | 5,319 | |
| EP4CE30F29C7N | FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 1803 LABs 532 IOs | Intel | 6,763 | |
| EP4CE6F17I7 | FPGA - a customizable integrated circuit that can be reprogrammed for various applications | Intel | 6,597 | |
| EP4CGX150DF31I7 | 60nm Technology FPGA Cyclone IV GX Family 1.2V 896-Pin FBGA 149760 Cells | Intel | 6,674 | |
| EPM2210F324C3 | Factory restriction on product acceptance | Intel | 9,929 | |
| M2GL090TS-1FG484M | FPGA IGLOO®2 Family 86184 Cells 1.2V 484-Pin FBGA Tray | Microchip Technology | 8,673 | |
| 5CEFA7F31C7N | Amplify Signals with Extended Range | Intel | 7,948 | |
| 5CSXFC6D6F31C8NES | SoC FPGA Cyclone V SX with dual-core ARM Cortex-A9 offering exceptional speed and efficiency | Intel | 5,569 | |
| A2F200M3F-FGG256I | FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA | Microchip Technology | 6,049 | |
| A2F500M3G-FGG484 | The A2F500M3G-FGG484 is a member of the FPGA SmartFusion Family, offering 500K gates and operating at a clock speed of 100MHz with 130nm technology | Microchip Technology | 7,519 | |
| A3P1000-FG144I | FPGA ProASIC®3 Family 1M Gates 231MHz 130nm Technology 1.5V 144-Pin FBGA Tray | Microchip Technology | 7,168 | |
| A3PE3000-FG484 | FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 484-Pin FBGA Tray | Microchip Technology | 6,643 | |
| AGL125V5-FG144I | Field Programmable Gate Array AGL125V5-FG144I | Microchip Technology | 9,449 | |
| AGL250V2-FG144I | FPGA IGLOO Family 250K Gates 130nm Technology 1.2V/1.5V 144-Pin FBGA Tray | Microchip Technology | 8,612 | |
| EP3C55F780C8N | EP3C55F780C8N is a high-performance FPGA with 55856 cells from the Cyclone® III Family, capable of running at a speed of 402MHz | Intel | 5,320 | |
| EP20K200EFC484-2X | With its APEX 20K design, this FPGA is versatile and efficient for various applications | Intel | 7,592 |