Fastpak-3

(3)

The Fastpak-3 provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With its 3-lead configuration, this package is designed for thermal efficiency and minimal footprint, making it ideal for space-constrained applications in various sectors including telecommunications, automotive, and consumer electronics.

Part Number Description Manufacturers Inventory Add To Bom
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Q6040P Alternistor for high-voltage applications ensures reliable power control and protection Littelfuse 6,394