DSO EP-36
(2)
The DSO-EP-36 (Dual Small Outline Package Exposed Pad) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With a 36-lead configuration, this package is designed for thermal efficiency and minimal footprint, making it ideal for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| TLE8261EXUMA1 | Robust and precise control for demanding industrial uses | Infineon Technologies Ag | 2,028 | |
| TLE8263EXUMA1 | A robust System Basis Chip for automotive applications, compliant with AEC-Qstandard | Infineon Technologies Ag | 7,014 |