DFNS-8
(3)
The DFNS-8 (Dual Flat No-lead Small Package) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Engineered for thermal efficiency and minimal footprint, this 8-lead configuration is well-suited for space-constrained applications in the telecommunications, automotive, and consumer electronics sectors.
| Part Number | Description | Manufacturers | Inventory | Add To Bom |
|---|---|---|---|---|
| 25LC512-I/MF | Serial EEPROM with SPI Interface, 512K-bit Capacity, 64K x 8 Configuration, Operates at 3.3V/5V | Microchip Technology | 6,076 | |
| 25LC256-M/MF | EEPROM Serial EEPROM with a capacity of 256K and dimensions of 32K x 8, designed for operation at 2.5V in MIL T environments | Microchip Technology | 5,544 | |
| TC4452VMF713 | Driver 13A 1-OUT Low Side Non-Inv Automotive AEC-Q100 8-Pin DFN-S EP T/R | Microchip Technology | 8,623 |