DFNEP-6

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DFNEP-6

The DFNEP-6 (Dual Flat No-leads Exposed Pad) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With a 6-lead configuration, this package is designed for optimal thermal efficiency and minimal footprint, making it ideal for space-constrained applications across various industries such as telecommunications, automotive, and consumer electronics.

Part Number Description Manufacturers Inventory Add To Bom
HMC656LP2E 5GHz fixed DFN EP T/R Analog Devices 9,131
HPP845E034R5 2-Wire, I2C Humidity/Temperature Sensor Digital Serial Te Connectivity Amp Connectors 8,950
HPP845E031R4 Serial digital temperature sensor, square shape, surface mount installation, 3 x 3 mm size, 14-bit resolution, RoHS compliant, DFN-6 package Te Connectivity Amp Connectors 5,477
HMC658LP2E Fixed Attenuator 25GHz 6-Pin DFN EP T/R Analog Devices 9,220
HPP845E031R5 Board Mount Humidity Sensors DIG REL HUMIDITY IC W/TEMP OUT Te Connectivity Amp Connectors 7,137
HMC653LP2ETR Essential component for signal attenuation in communication systems Analog Devices 5,386
HMC652LP2ETR Board-mountable signal attenuator Analog Devices 6,641