CSP-BGA-74

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CSP-BGA-74

The CSP-BGA-74 (Chip Scale Package - Ball Grid Array) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With a 74-ball grid array configuration, this package is designed for optimal thermal efficiency and minimal footprint, making it ideal for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.

Part Number Description Manufacturers Inventory Add To Bom
AD5516ABC-2 Accurate, -bit, -bit INCREMENT mode digital-to-analog converter suitable for high-performance system Analog Devices 4,062
AD5533ABCZ-1 AD5533ABCZ-1 Sample and Hold 32-CH 16us 74-Pin CSP-BGA Analog Devices 5,356