CSP-BGA-74
(2)The CSP-BGA-74 (Chip Scale Package - Ball Grid Array) provides a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. With a 74-ball grid array configuration, this package is designed for optimal thermal efficiency and minimal footprint, making it ideal for space-constrained applications in telecommunications, automotive, and consumer electronics sectors.
Part Number | Description | Manufacturers | Inventory | Add To Bom |
---|---|---|---|---|
AD5516ABC-2 | Accurate, -bit, -bit INCREMENT mode digital-to-analog converter suitable for high-performance system | Analog Devices | 4,062 | |
AD5533ABCZ-1 | AD5533ABCZ-1 Sample and Hold 32-CH 16us 74-Pin CSP-BGA | Analog Devices | 5,356 |